1.2 Mil Bare Copper Bonding Wire | High-Precision Semiconductor Packaging Solutions by Sichuan Winner

Pure Copper. Precision Bonding. Reliable Connections.

Advanced Copper Bonding Technology at 1.2 Mil

As semiconductor technology continues to advance, the demand for high-performance, cost-effective, and reliable interconnection materials is growing rapidly.

Wire bonding remains one of the most widely used technologies in semiconductor packaging, providing electrical connections between semiconductor chips and package substrates.

At Sichuan Winner, we focus on precision metal wire materials and customized solutions for advanced electronic applications.

Our 1.2 Mil (30.48μm) Bare Copper Bonding Wire offers a copper-based interconnection material option for semiconductor packaging applications requiring excellent electrical conductivity, mechanical strength, and controlled wire dimensions.

With a nominal diameter of just 1.2 mil, this ultra-fine copper wire can be evaluated for a variety of precision wire bonding processes.

What Is 1.2 Mil Bare Copper Bonding Wire?

Bare copper bonding wire is an uncoated copper wire developed for semiconductor interconnection applications.

Unlike gold-plated or palladium-coated bonding wires, bare copper bonding wire has no intentional precious-metal surface coating.

Copper is widely recognized for its excellent electrical and thermal conductivity, mechanical strength, and relatively low material cost compared with gold.

These characteristics make copper bonding wire an important material choice for semiconductor packaging.

Product Specifications

• Product Name: Bare Copper Bonding Wire

• Nominal Diameter: 1.2 mil

• Metric Equivalent: 0.03048mm (30.48μm)

• Base Material: Copper (Cu)

• Surface: Uncoated / Bare Copper

• Primary Application: Semiconductor Wire Bonding

Key Advantages of 1.2 Mil Bare Copper Bonding Wire

1. Excellent Electrical Conductivity

Copper provides high electrical conductivity, making it suitable for many electronic interconnection applications.

Its low electrical resistivity supports efficient current transmission in semiconductor packaging.

2. High Thermal Conductivity

Copper's excellent thermal conductivity can support heat transfer through electrical interconnections, although overall package thermal performance depends on the complete device design.

3. Good Mechanical Strength

Compared with conventional gold bonding wire, copper generally offers higher mechanical strength.

This property can be advantageous for certain bonding configurations, but bonding parameters must be carefully controlled to avoid damage to sensitive bonding pads.

4. Cost-Effective Material Solution

Copper is generally more economical than gold, making bare copper bonding wire an attractive option for cost-sensitive semiconductor packaging applications.

5. Precision Wire Diameter

With a nominal diameter of 1.2 mil (30.48μm), the wire can be considered for applications requiring controlled interconnection dimensions and consistent wire handling.

Precision Manufacturing and Quality Control

Producing ultra-fine bare copper bonding wire requires careful control of the wire drawing, annealing, and handling processes.

At a diameter of approximately 30 microns, variations in mechanical properties or surface condition can affect bonding performance.

Important manufacturing and inspection parameters include:

• Wire diameter and dimensional tolerance

• Copper purity and material consistency

• Tensile strength

• Elongation

• Surface cleanliness

• Oxidation control

• Wire straightness and spool winding quality

• Bonding performance

For bare copper bonding wire, surface oxidation is a particularly important consideration.

Appropriate storage conditions, packaging, and bonding process controls help maintain surface quality before use.

Applications in Semiconductor Packaging

1.2 Mil Bare Copper Bonding Wire may be evaluated for various electronic packaging applications.

Integrated Circuit (IC) Packaging

Copper bonding wire can provide electrical interconnections between semiconductor chips and package terminals in compatible IC packaging designs.

Discrete Semiconductor Devices

Bare copper wire may be considered for selected transistor, diode, and power semiconductor packages.

LED Packaging

Copper-based bonding wire may be evaluated for certain LED applications, depending on package design, bonding compatibility, and reliability requirements.

Sensor and Electronic Components

Precision copper bonding wire may support miniature electrical connections in selected sensor modules and electronic assemblies.

Industrial Semiconductor Packaging

Copper bonding wire is also used in semiconductor packaging processes where electrical performance, mechanical properties, and material cost are important considerations.

Application suitability must be confirmed through bonding trials and qualification testing.

Bonding Process Considerations

Bare copper bonding wire requires careful control of bonding conditions.

Because copper oxidizes more readily than gold, forming gas or another suitable protective atmosphere may be required during free-air ball formation.

Key bonding parameters may include:

• Electronic flame-off (EFO) settings

• Free-air ball (FAB) formation

• Bonding force

• Ultrasonic power

• Bonding temperature

• Wire loop geometry

• Bonding pad compatibility

• Wire pull and ball shear performance

Optimizing these parameters helps support stable bonding and reliable electrical connections.

Customized Copper Bonding Wire Solutions from Sichuan Winner

Different semiconductor packages require different wire properties and bonding conditions.

At Sichuan Winner, we aim to support customers with precision metal wire solutions based on their application requirements.

Customization and Technical Requirements

• Nominal wire diameter: 1.2 mil (30.48μm)

• Copper material specifications

• Mechanical property requirements

• Tensile strength and elongation targets

• Surface condition requirements

• Spool and packaging specifications

• Application-specific inspection criteria

Technical specifications and customization feasibility can be discussed according to customer requirements.

Why Choose Sichuan Winner?

At Sichuan Winner, we understand the importance of precision, consistency, and material quality in advanced electronic manufacturing.

We focus on supporting customers with precision wire materials and technical communication throughout the product evaluation process.

Our goal is to build long-term partnerships by understanding customer requirements and providing practical, customized material solutions.

From ultra-fine metal wires to specialized semiconductor bonding materials, Sichuan Winner continues to explore new possibilities in precision manufacturing.

Precision in Every Micron. Reliability in Every Connection.

As semiconductor devices become increasingly advanced, the importance of reliable bonding materials continues to grow.

Sichuan Winner's 1.2 Mil Bare Copper Bonding Wire represents a material solution for precision semiconductor interconnections, combining the inherent electrical and mechanical properties of copper with fine-wire manufacturing technology.

Small Diameter. Strong Connections. Big Possibilities.

Sichuan Winner — Precision in Every Micron. Quality in Every Connection.

Contact Sichuan Winner

Looking for 1.2 mil bare copper bonding wire for semiconductor packaging?

📩 Contact Sichuan Winner to discuss your wire specifications, bonding requirements, and customized material solutions.

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