Core Diameter: 25μm/27μm
Coating Thickness: 0.2 ~ 0.8μm
Core Diameter: 25μm/27μm
Coating Thickness: 0.2 ~ 0.8μm
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Length Meters: 500/1000
Core Diameter: 25μm/27μm
Core Diameter: 25μm/27μm
Coating Thickness: 0.2 ~ 0.8μm
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Core Wire Diameter: 25μm/27μm
Coating Thickness: 0.2 ~ 0.8μm
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Length Meters: 500/1000
Coating: Gold
Coating Thickness: 0.2 ~ 0.8μm
Max Temperature: 450℃
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Core Diameter: 25μm/27μm
Coating Thickness: 0.2 ~ 0.8μm
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Product Type: Bonding Wire
Coating: Au, Palladium
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