Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Core Diameter: 25μm/27μm
Coating Thickness: 0.2 ~ 0.8μm
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Product Type: Bonding Wire
Coating: Au, Palladium
Coating Thickness: 5 Microns
Temperature Range: -40°C To 150°C
Coating Thickness: 5 Microns
Temperature Range: -40°C To 150°C
Coating Thickness: 5 Microns
Temperature Range: -40°C To 150°C
Resistance: Corrosion
Thermal Conductivity: 401 W/mK
Application: Wire Bonding
Package: Spool
Application: Wire Bonding
Package: Spool
Application: Wire Bonding
Package: Spool
Application: Wire Bonding
Package: Spool
Application: Wire Bonding
Package: Spool
Product Type: Bonding Wire
Coating: Gold
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