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99.99% Pure BeCu Bonding Wire 0.01-0.4mm for Semiconductor Packaging

Purity: 99.99%

Bonding Method: Ultrasonic, Thermocompression, Laser

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Gold Plated Tungsten Wire 0.01mm for Electronics and R&D

Availability: Custom Sizes Available

Surface Finish: Bright

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Gold-Plated ICT FCT Spring Test Probes for Circuit Boards GKS-100 Series

Color: Black,black/red,White,Red & Black

Product Name: Test Probe

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0.01mm Palladium Coated Copper Bonding Wire High Strength Purity 99.99% Surface Finish Bright

Flexibility: Good

Bonding Method: Ultrasonic, Thermocompression, Laser

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Gold Plated Molybdenum Wire for Semiconductor Packaging 0.01-0.4mm

Application: Semiconductor Packaging, Microelectronics, Medical Devices

Package: Spool, Reel, Coil

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Gold Plated Tungsten Filament Wire 0.01mm-0.4mm for Electronics

Wire Diameter: 0.01mm-0.4mm

Package Weight: 2.2 Pounds

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Gold Plated Tungsten Wire for High Power RF Applications

Product Type: Bonding Wire

Wire Diameter: 0.001mm - 0.5mm

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Gold Plated Tungsten Wire Manufacturer | Custom Sizes For R&D, Medical, And Precision Assembly

Availability: Custom Sizes Available

Surface Finish: Bright

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High Temp Resistance Ultra Fine 0.01mm Gold Plated Tungsten Wire For Electronics & Scientific Research

Availability: Custom Sizes Available

Surface Finish: Bright

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Gold Plated Tungsten Wire 0.01mm High Temperature Resistant

Availability: Custom Sizes Available

Surface Finish: Bright

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Gold Plated Tungsten Wire 0.01mm High Temperature Resistant

Availability: Custom Sizes Available

Surface Finish: Bright

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Ultra Fine Tungsten Wire For Medical Technology

Wire Gauge: Dia 0.01mm~0.4 Or As Your Demand

Purity: 99.95% Min

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