Application: Wire Bonding
Package: Spool
Application: Wire Bonding
Package: Spool
Purity Of Tungsten Before Rhenium Addition: 99.999% W
Coating Thickness: 0.5 +/- 0.07
Product Type: Bonding Wire
Material: Ag
Product Type: Bonding Wire
Coating: Au ,Palladium
Package: Spool
Surface Finish: Bright
Package: Spool
Surface Finish: Bright
Package: Spool
Surface Finish: Bright
Package: Spool
Surface Finish: Bright
Package: Spool
Surface Finish: Bright
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Package: Spool
Surface Finish: Bright
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