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0.005mm Ultra-fine Unenamelled Copper Wire for PCB Soldering Repair

Application: Wire Bonding

Package: Spool

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Excellent Thermal Conductivity Ultra-thin Copper Wire For Microchips

Application: Wire Bonding

Package: Spool

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High-Performance Tungsten-Rhenium Wires for Extreme Environments

Purity Of Tungsten Before Rhenium Addition: 99.999% W

Coating Thickness: 0.5 +/- 0.07

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Good price Ag Alloy Bonding Wire For Semiconductor Devices online Video

Ag Alloy Bonding Wire For Semiconductor Devices

Product Type: Bonding Wire

Material: Ag

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1000m roll 18 micron (0.7 mil) diameter AuPdCu wire Bonding for Automotive Devices

Product Type: Bonding Wire

Coating: Au ,Palladium

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Automotive Grade PdCu Bonding Wire For Power Modules

Package: Spool

Surface Finish: Bright

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China Semiconductor Palladium Coated Copper Wire For Bonding

Package: Spool

Surface Finish: Bright

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Good price 30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor online Video

30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor

Application: Semiconductor Packaging, Microelectronics, Medical Devices

Package: Spool

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Good price Conductivity stabilty 18µm (0.7mil) Gold Bonding WIRE applycation in Aerospace online Video

Conductivity stabilty 18µm (0.7mil) Gold Bonding WIRE applycation in Aerospace

Application: Semiconductor Packaging, Microelectronics, Medical Devices

Package: Spool

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Good price 4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs online Video

4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs

Application: Semiconductor Packaging, Microelectronics, Medical Devices

Package: Spool

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Good price Ultra Fine 23µm (0.9mil) Gold Wire For Packaging Shops online Video

Ultra Fine 23µm (0.9mil) Gold Wire For Packaging Shops

Application: Semiconductor Packaging, Microelectronics, Medical Devices

Package: Spool

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Good price Gold Bonding Wire For Semiconductor Applications online Video

Gold Bonding Wire For Semiconductor Applications

Application: Semiconductor Packaging, Microelectronics, Medical Devices

Package: Spool

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