According to South Korea's "INEWS24" report on October 9, ZionMarket Research, a market research company, said on the 9th that from 2022 to 2028, the average annual growth rate of the semiconductor post-process market will reach 4.8%, and the market size will reach US$50.9 billion by 2028. Advanced packaging is the core technology for independent packaging of individual components in the semiconductor post-process, which is crucial to achieving low-power and high-performance digital transformation. With the increasing demand for semiconductors with various functions, packaging has become the main competitive advantage of semiconductor companies. Major companies such as Intel, Samsung Electronics and SK are competing to increase technology research and development and expand facilities in packaging.
Intel is developing a new generation of glass substrates and has invested US$1 billion in a semiconductor plant in Arizona, USA. Glass substrates have many advantages. Compared with traditional plastic substrates, they are one-quarter thinner, have relatively lower power consumption, can reduce the deformation rate of circuit diagrams by 50%, and can achieve higher interconnection density. They can be called system-in-package (SiP) chip complexes.
Samsung Electronics increased its investment in the Cheonan packaging production line this year to increase production capacity. Last year, it also established the "Advanced Package Group" to expand its packaging business and strengthen inter-departmental collaboration. Currently, Samsung Electronics is considering investing in a new packaging production line to meet the surge in demand for HBM mass production.
SK Hynix plans to invest $15 billion to build a packaging production line in the United States. If it completes subsidy negotiations with the US government, it will speed up the construction of the production line. SK Enpulse acquired ISC, a semiconductor testing solution company, for 500 billion won to enter the semiconductor post-process market. It plans to build the world's first high-performance semiconductor packaging glass substrate mass production plant in Georgia, USA.
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