Applications of palladium-plated copper wire: Can be used in integrated circuits, semiconductor packaging, LED packaging, optoelectronic packaging, etc.

Advantages:

Good Conductivity & Thermal Conductivity:

Copper has excellent electrical and thermal conductivity. The palladium plating doesn't much affect these. It transmits current and heat well for electronic signal and heat dissipation, ensuring component operation.

Strong Oxidation Resistance:

Palladium is a stable precious metal. The palladium layer on the wire surface stops copper core contact with air and moisture, preventing oxidation, prolonging wire life and enhancing device reliability.

Higher Hardness:

Palladium plated copper wire is harder than pure copper. It keeps shape and stability during wire bonding, reducing contact issues from deformation. But watch for cratering in wire bonding.

Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 0

1.What kind of Enameled copper wire do Winner produce?

We focus on research and development of selfbonding magnet round copper wire, fine polyurethane magnet wire, selfbonding litz copper wire and selfbonding silk covered wire.

2.What's diameters available of the Enamelled copper wire ?

We specialize in fine and ultra fine enamelled copper wire,diameters available of our products is Φ0.018-0.50mm.

3.What's selfbonding enameled copper wire?

Selfbonding enamelled copper wire is a special type of enamelled wire with an additional adhesive enamel overcoat such as thermoplastic resin.This adhesive has a bonding feature, which is activated

by heat or solvents.

Once activated the adhesive bonds turn to turn windings into a compact self supporting coil.

The use of selfbonding wire may offer cost and manufacturing advantages in some winding applications

as bobbins, tape, varnishing, or impregnation may be eliminated.

4. Is possible to get any sample of selfbonding enamelled copper wire that you have in production?

Of course you can!

Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 1

Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 2

Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 3

Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 4

Pd Coated Copper Wire
Type	Ø Diameter ±1% μm	Breaking Load BL(gf)	Elongation EL(%)	Length Meters
PW-1	18(0.7mil)	>4	8-14	500/1000/2000
	20(0.8mil)	>5	9-15	500/1000/2000
	23(0.9mil)	>7	10-17	500/1000/2000
	25(1.0mil)	>9	11-17	500/1000/2000
	30(1.2mil)	>14	14-22	500/1000/2000

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Microelectronic Packaging Palladium Plated Copper Wire

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High Strength Palladium Coated Copper Wire With 4N High Purity Copper Material For IC Packaging

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Stable Bonding Solutions with High-performance Palladium Plated Copper Wire For Microelectronic Packaging

Palladium Coated Copper Wire

pd coated cu wire

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