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High Tensile Strength Palladium Coated Copper Bonding Wire For Semiconductor

High Tensile Strength Palladium Coated Copper Bonding Wire For Semiconductor

high tensile palladium copper wire

semiconductor bonding wire palladium coated

palladium coated copper wire semiconductor

Place of Origin:

CHINA

Brand Name:

WINNER

Certification:

ISO9100

Model Number:

PW-12

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Product Details
Package:
Spool
Surface Finish:
Bright
Corrosion Resistance:
High
Availability:
Custom Sizes Available
Material:
Copper
Product Type:
Bonding Wire
Coating:
Palladium
Length Meters:
500/1000
Temperature Range:
-40°C To 200°C
Conductivity:
98%
Package Size:
100 Meters
Bond Strength:
High
Highlight:

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palladium coated copper wire semiconductor

Payment & Shipping Terms
Minimum Order Quantity
1PC
Price
999
Packaging Details
Roll, Neutrial Packing or with OEM LOGO
Delivery Time
5-8 WORKING DAYS
Payment Terms
L/C,Western Union,T/T Supply Ability
Supply Ability
100000 rolls per month
Product Description
Palladium Coated Copper Bonding Wire

Palladium Coated Copper Bonding Wire is easier to bond than your standard bare copper wire. The Palladium (Pd) coating allows for high performance and stable bonding, all within a wider bonding. The Pd coating controls the oxidation build up that can occur on the surface of the copper wire.

The Pd coating also extends the Highly Accelerated Stress Test (HAST) reliability. It prevents corrosion of the bonded wire span against halide attack from moulding compounds.

When using PCC bonding wire, you can be sure of excellent reliability, high performance and stable bonding. Ensure to use grounded wire bonding equipment when using PCC bonding wire. Also available in CLR2-2AT, contact our team should you require a quote for this.

Key Advantages
  • Enhanced bonding performance and stability
  • Superior oxidation control on copper surface
  • Extended HAST (Highly Accelerated Stress Test) reliability
  • Corrosion protection against halide attack from molding compounds
  • Wider bonding parameter window
Performance Benefits
  • High bonding reliability is obtained by stable palladium distribution to FAB surface layer
  • High and stable stitch bondability
  • Wide bonding window
Application Requirements
For optimal performance, use grounded wire bonding equipment when working with PCC bonding wire. This ensures proper handling and maximizes the benefits of the palladium coating.
Available Options
Also available in CLR2-2AT configuration. Contact our technical team for custom quotes and specific application requirements.
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