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Home > Products > Gold Plated Silver Wire >
15 μm Diameter Gold Plated Silver Wire Spooled Wire Ultra Fine Wire for High Frequency RF and Signal Integrity Applications

15 μm Diameter Gold Plated Silver Wire Spooled Wire Ultra Fine Wire for High Frequency RF and Signal Integrity Applications

15 μm gold plated silver wire

ultra fine wire for RF applications

high frequency signal integrity wire

Place of Origin:

China

Brand Name:

WINNER

Certification:

ISO9100

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Request A Quote
15 μm Diameter Gold Plated Silver Wire Spooled Wire Ultra Fine Wire for High Frequency RF and Signal Integrity Applications
15 μm Diameter Gold Plated Silver Wire Spooled Wire Ultra Fine Wire for High Frequency RF and Signal Integrity Applications 15 μm Diameter Gold Plated Silver Wire Spooled Wire Ultra Fine Wire for High Frequency RF and Signal Integrity Applications 15 μm Diameter Gold Plated Silver Wire Spooled Wire Ultra Fine Wire for High Frequency RF and Signal Integrity Applications
Product Details
Product Type:
Bonding Wire
Coating:
Gold
Bond Strength:
High
Certifications:
ISO 9001
Corrosion Resistance:
High
Elongation:
3-20%
Surface Finish:
Smooth, Matte, Textured
Diameter:
18 μm To 25 μm
Material:
Gold, Silver
Purity:
99.99%
Highlight:

15 μm gold plated silver wire

,

ultra fine wire for RF applications

,

high frequency signal integrity wire

Payment & Shipping Terms
Minimum Order Quantity
1000m
Price
999
Packaging Details
Roll, Neutrial Packing or with OEM LOGO
Delivery Time
5-8 days
Payment Terms
T/T,D/A,Western Union
Supply Ability
9999999
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15 μm Diameter Gold Plated Silver Wire Spooled Wire Ultra Fine Wire for High Frequency RF and Signal Integrity Applications

Get Best Price
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Product Description
15 μm Diameter Gold Plated Silver Wire Spooled Wire Ultra Fine Wire for High Frequency RF and Signal Integrity Applications

Ultra Fine Gold Plated Silver Wire is designed for high-performance semiconductor and microelectronic applications. Combining the superior conductivity of silver with a thin gold plating layer, this wire offers excellent bonding performance, oxidation resistance, and long-term reliability.

With diameters ranging from 15 μm to 25 μm, it is widely used as a cost-effective alternative to traditional gold bonding wire in IC packaging, LED assembly, and precision electronics manufacturing.

Our advanced manufacturing process ensures:

  • Consistent diameter tolerance

  • Smooth surface finish

  • Stable bonding behavior

  • High tensile strength

This makes it an ideal solution for manufacturers seeking both performance and cost optimization.

15 μm Diameter Gold Plated Silver Wire Spooled Wire Ultra Fine Wire for High Frequency RF and Signal Integrity Applications 0


15 μm Diameter Gold Plated Silver Wire Spooled Wire Ultra Fine Wire for High Frequency RF and Signal Integrity Applications 1


15 μm Diameter Gold Plated Silver Wire Spooled Wire Ultra Fine Wire for High Frequency RF and Signal Integrity Applications 2


15 μm Diameter Gold Plated Silver Wire Spooled Wire Ultra Fine Wire for High Frequency RF and Signal Integrity Applications 3


Tags：

Ultra Fine Gold Plated Silver Wire

High Purity gold plated silver wire

gold plated silver wire

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Tel：86-158-1857-6616
Email：sales@winner-sc.com
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Sichuan WINNER Special Electronic Materials Co., Ltd. focuses on ultra-fine coated metal wire for semiconductor packaging. Winner is a global leader!
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