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Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections

Ultra Fine 15um Palladium Coated Copper Wire for Chip Packaging and High-Density Interconnections

15um palladium coated copper wire

ultra fine palladium copper wire

chip packaging palladium coated wire

Place of Origin:

CHINA

Brand Name:

WINNER

Certification:

ISO9100

Model Number:

PW-12

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Product Details
Coating Thickness:
5 Microns
Temperature Range:
-40°C To 150°C
Availability:
Custom Sizes Available
Conductivity:
98%
Electricalconductivity:
Excellent
Compliancestandards:
RoHS, REACH
Color:
Silver
Tensile Strength:
High
Purity:
99.9% Copper
Surfacefinish:
Smooth, Shiny Palladium Layer
Package Size:
100 Meters
Tensilestrength:
High
Operatingtemperaturerange:
-40°C To 150°C
Coatingmaterial:
Palladium
Surface Finish:
Smooth, Shiny Palladium Layer
Coating Material:
Palladium
Highlight:

15um palladium coated copper wire

,

ultra fine palladium copper wire

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chip packaging palladium coated wire

Payment & Shipping Terms
Minimum Order Quantity
1PC
Price
999
Packaging Details
Roll, Neutrial Packing or with OEM LOGO
Delivery Time
5-8 WORKING DAYS
Payment Terms
L/C,Western Union,T/T Supply Ability
Supply Ability
100000 rolls per month
Product Description
Ultra Fine Palladium Coated Copper Wire 15um 20um 25um Bonding Wire for Chip Packaging
Product Overview

Ultra fine Pd coated copper bonding wire designed for advanced chip packaging with fine pitch and high-density interconnections.

  • Available in 15μm, 20μm, and 25μm diameters
  • Palladium coating for enhanced performance
  • Ideal for fine pitch applications
  • Optimized for high-density interconnections
  • Advanced chip packaging solutions


Company Information

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