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Ultra Fine Gold Plated Molybdenum Wire in Stock High Reliability for Semiconductor Packaging

Ultra Fine Gold Plated Molybdenum Wire in Stock High Reliability for Semiconductor Packaging

gold plated molybdenum wire semiconductor

ultra fine molybdenum wire high reliability

gold plated wire for semiconductor packaging

Place of Origin:

CHINA

Brand Name:

WINNER

Certification:

ISO9100

Model Number:

MW001

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Product Details
Application:
Semiconductor Packaging, Microelectronics, Medical Devices
Package:
Spool
Corrosion Resistance:
High
Bond Strength:
High
Length Meters:
500/1000
Product Type:
Bonding Wire
Coating:
Gold
Purity:
99.999%
Bonding Method:
Ultrasonic
Temperature Range:
-40°C To 200°C
Surface Finish:
Bright
Conductivity:
98%
Package Size:
100 Meters
Core Diameter:
25μm/27μm
Coating Thickness:
0.2 ~ 0.8μm
Max Temperature:
450℃
Temperature Shock:
-196 ~ 250℃
Highlight:

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gold plated wire for semiconductor packaging

Payment & Shipping Terms
Minimum Order Quantity
1PC
Price
999
Packaging Details
Roll, Neutrial Packing or with OEM LOGO
Delivery Time
5-8 WORKING DAYS
Payment Terms
L/C,Western Union,T/T
Supply Ability
100000 rolls per month
Product Description

Ultra Fine Gold Plated Molybdenum Wire in Stock High Reliability for Semiconductor Packaging


Ready in stock with short lead time, this ultra fine wire offers high reliability and stable quality for mass production in semiconductor packaging lines.

Technical Parameters
Items Data
Chemical analysis (wt%) Mo ≥ 99.9%, Au : 99.99%
Core wire diameter 25μm/27μm in stock, customized
Coating thickness 0.2 ~ 0.8μm
Max. using temperature 450℃
Anti-temperature shock bear -196 ~ 250℃ fast cyclical impact

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