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0.015mm Palladium Coated Copper Bonding Wire Anti-Oxidation Advanced CSP IC Packaging Wire

0.015mm Palladium Coated Copper Bonding Wire Anti-Oxidation Advanced CSP IC Packaging Wire

0.015mm palladium coated copper wire

anti-oxidation bonding wire

CSP IC packaging wire

Place of Origin:

CHINA

Brand Name:

WINNER

Certification:

ISO9100

Model Number:

PW-12

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Product Details
Product Type:
Bonding Wire
Coating:
Au, Palladium
Material:
Copper
Package:
Spool
Surface Finish:
Bright
Corrosion Resistance:
High
Availability:
Custom Sizes Available
Length Meters:
500/1000
Package Size:
100 Meters
Bond Strength:
High
Highlight:

0.015mm palladium coated copper wire

,

anti-oxidation bonding wire

,

CSP IC packaging wire

Payment & Shipping Terms
Minimum Order Quantity
1PC
Price
999
Packaging Details
Roll, Neutrial Packing or with OEM LOGO
Delivery Time
5-8 WORKING DAYS
Payment Terms
L/C,Western Union,T/T Supply Ability
Supply Ability
100000 rolls per month
Product Description
0.015mm Palladium Coated Copper Bonding Wire Anti-Oxidation Advanced CSP IC Packaging Wire
Ultra-fine 0.015mm Pd coated copper wire with compact palladium layer, stops copper oxidation, perfect for miniaturized CSP advanced chip packaging.


  • Superior cost-effectiveness compared to gold bonding wire
  • Excellent performance in semiconductor packaging applications
  • Widely accepted and implemented across the industry
  • Maintains reliability and bonding quality standards

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