1.5mil Pure Copper Bonding Wire (38.1μm) | High-Performance Semiconductor Packaging Solutions – Sichuan Winner

Pure Copper. Precision Bonding. Reliable Connections.

Product Overview

At Sichuan Winner Special Electronic Materials Co., Ltd., we believe that every reliable semiconductor connection begins with precision materials and continuous innovation.

Our 1.5mil (38.1μm) Pure Copper Bonding Wire is a high-performance interconnection material designed for semiconductor packaging, integrated circuit assembly, and advanced microelectronic applications.

Manufactured using a high-purity copper core, this bonding wire offers excellent electrical conductivity, thermal conductivity, and mechanical strength, making it an attractive alternative to traditional gold bonding wire in suitable semiconductor packaging processes.

With a nominal diameter of 1.5mil, our pure copper bonding wire is designed to support precision wire bonding applications requiring reliable electrical connections, controlled wire-loop formation, and consistent material properties.

At Sichuan Winner, we don't just supply bonding wires. We develop customized material solutions to meet your unique semiconductor packaging challenges.

Key Product Features & Advantages

1. Excellent Electrical Conductivity

Copper offers excellent electrical conductivity, supporting efficient current transmission and low-resistance electrical interconnections.

Its conductive properties make it suitable for various semiconductor packaging applications requiring stable electrical performance.

2. Superior Thermal Conductivity

The excellent thermal conductivity of copper helps facilitate heat transfer within semiconductor packaging structures.

This characteristic is particularly valuable for applications requiring efficient thermal management.

3. High-Purity Copper Material

High-purity copper provides a foundation for consistent electrical properties and precision bonding performance.

Material purity, surface cleanliness, and microstructural consistency are important considerations in semiconductor wire bonding.

4. Precision Diameter – 1.5mil (38.1μm)

The nominal diameter of 1.5mil supports semiconductor packaging applications requiring controlled wire dimensions and mechanical properties.

5. Reliable Wire Bonding Performance

With appropriate equipment, protective atmosphere, and optimized bonding parameters, pure copper bonding wire can support stable free-air ball formation, ball bonding, stitch bonding, and controlled wire-loop formation.

6. Cost-Effective Semiconductor Interconnection

Compared with gold bonding wire, copper bonding wire can offer significant raw material cost advantages while maintaining excellent electrical and thermal properties.

Actual cost savings depend on bonding processes, equipment, yield, and reliability requirements.

Product Specifications

R&D Capabilities – Innovation in Every Connection

Your Packaging Challenges Inspire Our Innovation.

At Sichuan Winner, we understand that semiconductor packaging technologies are evolving toward higher integration, improved electrical performance, and increasingly demanding reliability standards.

Our R&D-oriented approach focuses on precision material development, copper wire processing, mechanical property optimization, and customer-specific bonding solutions.

1. High-Purity Copper Material Development

Evaluating copper purity, microstructure, surface cleanliness, and material consistency to support semiconductor packaging requirements.

2. Precision Wire Manufacturing

Focusing on wire diameter consistency, surface finish, and dimensional stability for precision bonding applications.

3. Mechanical Property Optimization

Reviewing tensile strength, elongation, wire flexibility, and loop-forming characteristics according to different semiconductor packaging processes.

4. Bonding Performance Evaluation

Supporting technical discussions related to free-air ball formation, ball bonding, stitch bonding, wire-loop stability, and process compatibility.

5. Surface Quality & Oxidation Control

Exploring material handling, surface cleanliness, packaging, and oxidation-control considerations for uncoated copper bonding wire.

6. Customized Product Development

Working with customers to evaluate non-standard specifications through technical feasibility reviews, sample development, and application-oriented optimization.

Personalized Customization – Engineered for Your Application

Your Design. Our Expertise. Your Customized Bonding Wire.

At Sichuan Winner, we understand that different semiconductor packaging processes require different bonding wire properties.

We aim to provide flexible material solutions based on customer requirements, equipment compatibility, and application needs.

Our customization options include:

• Custom Wire Diameter: Precision copper bonding wire dimensions according to customer specifications.

• Custom Copper Material Grade: Material purity and characteristics based on technical feasibility.

• Custom Mechanical Properties: Tensile strength, elongation, and flexibility requirements.

• Custom Surface Quality: Surface cleanliness and finish specifications.

• Custom Wire Length: Spool lengths according to production requirements.

• Custom Spool Configuration: Packaging designed for different bonding equipment and handling needs.

• Application-Specific Optimization: Material evaluation for different bonding machines and semiconductor packaging processes.

• Special R&D Projects: Collaborative development of non-standard precision copper bonding wire.

All customized specifications are subject to technical evaluation, manufacturing feasibility, and customer qualification.

Potential Applications

Our 1.5mil pure copper bonding wire can be evaluated for:

• Semiconductor IC Packaging

• Integrated Circuit Wire Bonding

• Discrete Semiconductor Devices

• Power Semiconductor Packaging

• LED Packaging

• Microelectronic Interconnections

• Electronic Component Assembly

• Customized Semiconductor Packaging Processes

Final suitability depends on device design, bonding equipment, process parameters, and reliability qualification.

Quality & Reliability Considerations

At Sichuan Winner, we recognize that consistent material properties are essential for reliable semiconductor packaging.

Important quality considerations for pure copper bonding wire include:

Diameter Consistency

Maintaining controlled wire dimensions to support predictable bonding behavior.

Mechanical Properties

Evaluating tensile strength and elongation to support wire handling and loop formation.

Surface Cleanliness

Controlling surface contamination and oxidation, which may influence bonding performance.

Bonding Compatibility

Evaluating free-air ball formation, ball shear strength, wire pull strength, and stitch bond performance under customer-specific process conditions.

Reliability Evaluation

Supporting qualification requirements related to thermal cycling, high-temperature storage, and humidity exposure, where applicable.

Specific performance and reliability values should be confirmed through testing and agreed product specifications.

Why Choose Sichuan Winner?

Precision Materials. Continuous Innovation. Personalized Solutions.

At Sichuan Winner Special Electronic Materials Co., Ltd., we focus on specialty electronic materials and precision bonding wire solutions.

Our customer-oriented approach emphasizes:

• Precision copper bonding wire solutions

• Research and development support

• Customized technical specifications

• Material quality and consistency

• Professional technical communication

• Application-oriented product development

• Long-term customer partnerships

We believe that successful semiconductor packaging requires reliable materials, technical collaboration, and continuous improvement.

Let's Develop Your Next Bonding Wire Solution

Are you looking for 1.5mil pure copper bonding wire for semiconductor packaging?

Do you require specific tensile strength, elongation, or spool configurations?

Are you developing a new IC packaging process or looking for an alternative to gold bonding wire?

Share your technical requirements with us. Let's explore a suitable material solution together.

For technical evaluation and quotation, please provide:

• Required wire diameter and tolerance

• Copper purity requirements

• Tensile strength and elongation specifications

• Bonding equipment and process conditions

• Spool type and required length

• Estimated order quantity

• Intended semiconductor application

Contact Sichuan Winner

Sichuan Winner Special Electronic Materials Co., Ltd.

Website: www.winner-sc.com

Contact us for customized specifications, technical discussions, sample inquiries, and quotations.

Not Just a Bonding Wire. A Connection Engineered for Reliability.

Precision in Every Micron. Reliability in Every Bond.

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