0.05mm Gold-Plated Tungsten Wire (50μm) | High-Strength Precision Wire with Custom Gold Coating – Sichuan Winner

Ultra-Fine Precision. Gold-Plated Performance. Engineered for Innovation.

Product Overview

Sichuan Winner Special Electronic Materials Co., Ltd. offers 0.05mm Gold-Plated Tungsten Wire (50μm), a precision specialty metal wire combining the mechanical properties of a tungsten core with the functional advantages of a gold-plated surface.

Designed for advanced electronic components, miniature sensors, precision electrical contacts, microelectronic assemblies, and specialized industrial applications, this fine wire offers a combination of dimensional precision, mechanical strength, conductive surface characteristics, and corrosion resistance.

The tungsten core provides excellent stiffness, a high melting point, and mechanical stability, while the gold-plated layer contributes good surface electrical conductivity, oxidation resistance, and stable electrical contact characteristics under suitable operating conditions.

With a focus on precision manufacturing, material research, and application-specific customization, Sichuan Winner aims to support customers developing increasingly sophisticated electronic technologies.

More Than a Fine Wire — A Customized Precision Material Solution.

Key Features & Advantages

1. Ultra-Fine 0.05mm Diameter

With a nominal diameter of 0.05mm (50 micrometers), this gold-plated tungsten wire is designed for applications requiring small wire dimensions and precise material control.

Its fine diameter makes it a potential choice for miniature electronic components, precision assemblies, and specialized micro-scale devices.

2. High-Strength Tungsten Core

Tungsten is widely recognized for its high melting point, stiffness, and mechanical strength.

The tungsten core offers valuable characteristics for applications requiring controlled wire tension, dimensional stability, and resistance to mechanical deformation.

Actual tensile strength and flexibility depend on wire processing conditions and finished material specifications.

3. Conductive Gold-Plated Surface

The gold-plated surface provides several potential advantages:

• Good surface electrical conductivity

• Enhanced resistance to oxidation and tarnishing

• Improved surface corrosion resistance

• Stable electrical contact characteristics

• Suitability for selected electronic connection applications

Performance depends on gold coating thickness, uniformity, adhesion, and operating conditions.

4. Precision Diameter Control

Fine-wire applications require careful dimensional control.

Our manufacturing approach emphasizes wire diameter consistency, controlled processing, and surface quality to support customer-specific technical requirements.

5. Gold Coating Engineering

Gold coating thickness and surface characteristics may be evaluated according to application requirements.

Technical development can focus on coating continuity, thickness consistency, adhesion, and electrical contact performance.

6. Customizable Specifications

Sichuan Winner supports technical discussions and customized development involving wire diameter, gold coating thickness, tensile strength, elongation, spool configuration, and other application-specific parameters.

Technical Specifications

Technical Note: Please confirm whether 0.05mm represents the finished outer diameter after gold plating or the tungsten core diameter before plating. Final dimensions, tolerances, and coating thickness should be defined in the agreed technical specifications.

Research & Development – Precision Meets Innovation

Your Technical Challenges Inspire Our Material Innovation.

At Sichuan Winner, we understand that advanced electronic applications require precision materials with carefully controlled mechanical, dimensional, and surface properties.

Our R&D-oriented approach focuses on developing specialty metal wire solutions for demanding electronic and industrial applications.

Precision Tungsten Wire Processing

Exploring fine-wire manufacturing techniques to support dimensional consistency, material integrity, and stable handling characteristics.

Gold Coating Technology

Evaluating coating thickness, uniformity, adhesion, and surface characteristics for specialized electronic applications.

Mechanical Property Optimization

Reviewing tensile strength, elongation, flexibility, and wire-handling performance according to customer requirements.

Surface Quality Development

Focusing on coating continuity, surface cleanliness, and material consistency to support dependable electrical contact behavior.

Application-Oriented Engineering

Working with customers to understand assembly methods, operating environments, and functional requirements before evaluating suitable material specifications.

Collaborative R&D Projects

Supporting technical discussions, sample evaluation, and customized development for non-standard wire applications.

From Material Selection to Micron-Level Engineering, Every Detail Matters.

Personalized Customization – Engineered for Your Application

Your Design. Your Requirements. Our Precision Solutions.

Every electronic and industrial application has unique technical requirements.

Sichuan Winner supports customer-oriented customization and technical evaluation involving:

• Custom Wire Diameter: Fine-wire dimensions and tolerance requirements.

• Custom Gold Coating: Coating thickness, surface finish, and adhesion requirements.

• Custom Mechanical Properties: Tensile strength, elongation, and flexibility.

• Custom Surface Characteristics: Surface cleanliness and coating uniformity.

• Custom Spool Configuration: Spool size, wire length, and protective packaging.

• Special Material Development: Evaluation of application-specific material requirements.

• R&D Collaboration: Technical feasibility studies and sample development.

All customization options are subject to technical assessment and manufacturing feasibility.

Potential Applications

1. Precision Electronic Components

Fine conductive wire for miniature electronic structures, specialized assemblies, and precision electrical components.

2. Sensors & Detectors

Potential use in selected miniature sensors, detectors, and precision sensing assemblies.

3. Microelectronic Components

Gold-plated precision wire for selected miniature electronic assemblies requiring controlled dimensions and conductive surface characteristics.

4. Semiconductor Research & Specialized Packaging

Material evaluation for selected semiconductor-related research, precision assembly, and specialized interconnection applications.

5. Precision Electrical Contacts

Specialty wire elements for selected electrical contact and connection applications.

6. Test & Measurement Equipment

Fine-wire materials for laboratory instruments, precision test fixtures, and measurement devices.

7. Customized Industrial Applications

Specialty metal wire solutions for miniature components, research projects, and application-specific precision manufacturing.

Application Note: Suitability for semiconductor wire bonding, welding, soldering, or other joining processes must be confirmed through application-specific testing. Gold-plated tungsten wire is not necessarily interchangeable with conventional gold bonding wire.

Quality & Reliability Considerations

Precision Is More Than a Diameter — It Is Consistency in Every Detail.

Important quality considerations for 0.05mm Gold-Plated Tungsten Wire include:

Diameter Consistency

Verification of wire diameter and dimensional tolerance against agreed specifications.

Gold Coating Uniformity

Evaluation of coating thickness, continuity, and surface coverage.

Coating Adhesion

Assessment of coating integrity during wire handling and intended processing.

Mechanical Performance

Evaluation of tensile strength, elongation, and wire breakage characteristics.

Surface Cleanliness

Attention to contamination and surface defects that may affect electrical contact performance.

Packaging Protection

Appropriate spool handling and protective packaging to reduce tangling, deformation, and surface damage.

Inspection methods, acceptance criteria, and reliability testing should be agreed according to the intended application.

Why Choose Sichuan Winner?

Precision Materials. Continuous R&D. Customized Engineering.

At Sichuan Winner Special Electronic Materials Co., Ltd., we focus on specialty electronic materials and precision metal wire solutions.

Our product development philosophy emphasizes:

• Fine and ultra-fine specialty metal wire materials

• Precision wire manufacturing and dimensional control

• Gold-plated tungsten wire solutions

• Research and development collaboration

• Customer-specific product customization

• Application-oriented technical support

• Material quality and consistency

• Long-term customer partnerships

We aim to support customers through precision processing, technical communication, and collaborative material development.

Request Your Customized Gold-Plated Tungsten Wire

Are you looking for 0.05mm Gold-Plated Tungsten Wire for electronic components, sensors, or precision manufacturing?

Do you require a specific gold coating thickness, wire diameter tolerance, or tensile strength?

Are you developing a specialized electronic device requiring a customized fine-wire material?

Contact Sichuan Winner to discuss your technical requirements and explore a precision wire solution.

For technical evaluation and quotation, please provide:

• Required wire diameter and tolerance

• Whether 0.05mm refers to finished outer diameter or tungsten core diameter

• Gold coating thickness

• Tensile strength and elongation requirements

• Intended application and operating conditions

• Spool type and required wire length

• Estimated order quantity

Contact Us

Sichuan Winner Special Electronic Materials Co., Ltd.

Website: www.winner-sc.com

Product: 0.05mm Gold-Plated Tungsten Wire (50μm)

Contact us for custom specifications, technical discussions, sample inquiries, and quotations.

Ultra-Fine Precision. Gold-Plated Performance. Engineered for Innovation.

Precision in Every Micron. Strength in Every Connection.

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