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Home > products > Bonding Wire >
Ultra Pure Aluminum Bonding Wire With High Conductivity Aluminum Wire For Wire Bonding

Ultra Pure Aluminum Bonding Wire With High Conductivity Aluminum Wire For Wire Bonding

0.05mm aluminum bonding wire

0.001mm aluminum bonding wire

Electronics aluminum wire for wire bonding

Place of Origin:

China

Brand Name:

WINNER

Certification:

ISO9001

Model Number:

WNE T10

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Ultra Pure Aluminum Bonding Wire With High Conductivity Aluminum Wire For Wire Bonding
Ultra Pure Aluminum Bonding Wire With High Conductivity Aluminum Wire For Wire Bonding Ultra Pure Aluminum Bonding Wire With High Conductivity Aluminum Wire For Wire Bonding Ultra Pure Aluminum Bonding Wire With High Conductivity Aluminum Wire For Wire Bonding
Product Details
Diameter:
0.001mm - 0.05mm
Breaking Load BL(gf):
>4
Elongation EL(%):
3-20
Wire Bonding Type:
Ball Bonding, Wedge Bonding, Ribbon Bonding
Material:
Aluminum
Application:
Semiconductor, Electronics, Medical Devices
Highlight:

0.05mm aluminum bonding wire

,

0.001mm aluminum bonding wire

,

Electronics aluminum wire for wire bonding

Payment & Shipping Terms
Minimum Order Quantity
1pc
Price
1~999
Packaging Details
Roll, Neutrial Packing or with OEM LOGO
Delivery Time
5~8 working days.
Payment Terms
T/T, Western Union, L/C
Supply Ability
1000000 rolls per month
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86-15818576616
sales@winner-sc.com
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Product Description

Ultra Pure Aluminum Bonding Wire with High Conductivity for Wire Bonding Applications

Optimize semiconductor packaging performance with our Ultra Pure Aluminum Bonding Wire (99.999% purity), engineered for superior electrical conductivity and thermal stability in high-density integrated circuits. Designed for wire bonding processes, this aluminum wire minimizes signal loss and enhances reliability in power devices, MEMS sensors, and automotive electronics.

 

Key features include:

  • Enhanced Mechanical Strength: Doped with 1% magnesium to eliminate second-phase particles, improving fatigue resistance and bonding durability under extreme thermal cycling
  • Fine Diameter Range: Available in 15–50 µm for precision bonding in microprocessors and advanced ICs
    .
  • Oxidation Resistance: Optimized surface treatment ensures stable performance even in humid or corrosive environments

Ideal for ultrasonic and thermosonic bonding, our wire reduces production costs compared to gold alternatives while maintaining compatibility with aluminum (Al-Al) and gold (Al-Au) pad material.

 

 
* Our high quality welding wire is meticulously crafted from 6N high purity aluminum material. This top grade aluminum forms the core of the wire, providing it with remarkable electrical conductivity and other outstanding physical properties. Moreover, a specific proportion of carefully selected trace elements are added to this base material. These trace elements are crucial as they work in harmony with the aluminum to enhance the overall performance of the welding wire, making it more suitable for a wide range of applications.

* This welding wire finds extensive use in the packaging of power semiconductors. It is an essential component in the manufacturing process of various power semiconductor devices including MOSFET (Metal - Oxide - Semiconductor Field - Effect Transistor), which is widely utilized in power supply circuits and motor control systems. IGBT (Insulated Gate Bipolar Transistor), a key element in high - power applications like electric vehicle inverters and industrial motor drives, also relies on this welding wire for its packaging needs. Additionally, it is used in the packaging of Thyristor, which is commonly employed in power control systems due to its ability to handle high current and voltage. GTO (Gate Turn - Off Thyristor), with its unique turn - off capability and applications in high - power switching circuits, also depends on this welding wire. 
 
 

Al Wire for Power

Type

Ø Diameter

(μm)

Breaking Load

BL(gf)

Elongation

EL(%)

Length

Meters

WNE T1

100±5

50~100

10~30

500/1000/2000

125±5

60~120

10~30

500/1000/2000

150±5

100~200

10~30

500/1000/2000

170±5

140~240

10~30

500/1000/2000

200±7

150~250

10~30

500/1000/2000

 

Bonded aluminum wire applications:

* Automotive electronics

* Consumer electronics

* Computing equipment

* Chip on board (COB) technology

* Bonding of discrete components (diodes, transistors, capacitors, resistors)

* Bonding of hybrid components

 

Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 0

1.What kind of Enameled copper wire do Winner produce?

We focus on research and development of selfbonding magnet round copper wire, fine polyurethane magnet wire, selfbonding litz copper wire and selfbonding silk covered wire.

 

2.What's diameters available of the Enamelled copper wire ?

We specialize in fine and ultra fine enamelled copper wire,diameters available of our products is Φ0.018-0.50mm.

 

3.What's selfbonding enameled copper wire?

Selfbonding enamelled copper wire is a special type of enamelled wire with an additional adhesive enamel overcoat such as thermoplastic resin.This adhesive has a bonding feature, which is activated

by heat or solvents.

Once activated the adhesive bonds turn to turn windings into a compact self supporting coil.

The use of selfbonding wire may offer cost and manufacturing advantages in some winding applications

as bobbins, tape, varnishing, or impregnation may be eliminated.

 

4. Is possible to get any sample of selfbonding enamelled copper wire that you have in production?

Of course you can!

Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 1

Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 2

Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 3

 

Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 5

Tags：

Aluminum Bonding Wire

wire bond wire

aluminium bonding wire

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