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Bonding Wire

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Gold Plated Tungsten Wire

(75)

Gold Plated Copper Wire

(21)

Gold Plated Molybdenum Wire

(50)

Tungsten Wire

(25)

Gold Plated Silver Wire

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(42)

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wire bond wire (301)  Online Manufacturer

Good price 99.99% Silver Alloy Wire Bond Wire For Heat Dissipation And Electrical Conductivity online Video

99.99% Silver Alloy Wire Bond Wire For Heat Dissipation And Electrical Conductivity

Diameter: 18(0.7mil)

Breaking Load BL(gf): >4

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Good price 0.01mm Diameter Ultra Fine Gold Bonding Wire Meeting the Demands of Ultra-Fine Electronic Bonding online Video

0.01mm Diameter Ultra Fine Gold Bonding Wire Meeting the Demands of Ultra-Fine Electronic Bonding

Density: 19.34 G/cm3

Purity: 99.99%

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Good price Extreme bond reliability 0.01mm Ultra Fine Gold Bonding Wire for various applications online Video

Extreme bond reliability 0.01mm Ultra Fine Gold Bonding Wire for various applications

Density: 19.34 G/cm3

Purity: 99.99%

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Good price Ultra Fine Wire 0.01mm Diameter Gold Bonding Wire For Semiconductor Packaging online Video

Ultra Fine Wire 0.01mm Diameter Gold Bonding Wire For Semiconductor Packaging

Density: 19.34 G/cm3

Purity: 99.99%

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Good price Ultra Fine Gold Bonding Wire with 0.01mm Diameter Optimal for Delicate Electronic Assemblies online Video

Ultra Fine Gold Bonding Wire with 0.01mm Diameter Optimal for Delicate Electronic Assemblies

Density: 19.34 G/cm3

Purity: 99.999%

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Good price Ultra Pure Aluminum Bonding Wire With High Conductivity Aluminum Wire For Wire Bonding online Video

Ultra Pure Aluminum Bonding Wire With High Conductivity Aluminum Wire For Wire Bonding

Diameter: 0.001mm - 0.05mm

Breaking Load BL(gf): >4

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Good price Premium Ultra Fine Wire Gold Bonding Wire for Advanced Electronic Bonding Applications online Video

Premium Ultra Fine Wire Gold Bonding Wire for Advanced Electronic Bonding Applications

Density: 19.34 G/cm3

Purity: 99.99%

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Good price High tensile test performance Ultra Fine Wire Gold Bonding Wire for semiconductor packaging and assembly processes online Video

High tensile test performance Ultra Fine Wire Gold Bonding Wire for semiconductor packaging and assembly processes

Density: 19.34 G/cm3

Purity: 99.99%

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Good price 99.999% Purity 0.01mm Diameter Ultra Fine Gold Bonding Wire for Automotive and Aerospace applications online Video

99.999% Purity 0.01mm Diameter Ultra Fine Gold Bonding Wire for Automotive and Aerospace applications

Density: 19.34 G/cm3

Purity: 99.99%

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Good price Ultra Fine Gold Bonding Wire of 0.01mm Diameter Driving Innovation in Microscale Electronics online Video

Ultra Fine Gold Bonding Wire of 0.01mm Diameter Driving Innovation in Microscale Electronics

Density: 19.34 G/cm3

Purity: 99.99%

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Good price High Conductivity 0.01 Mm Ultra Fine Wire Copper Bonding Wire For Electronics And Communications online Video

High Conductivity 0.01 Mm Ultra Fine Wire Copper Bonding Wire For Electronics And Communications

Bond Strength: High

Elongation: 1% - 50%

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Good price Ultra Fine Pd Coated Copper Wire With Bright Blue Coating High Strength 0.01mm Silver Core Bonding Wire For Semiconductor And 5G Device Assembly online

Ultra Fine Pd Coated Copper Wire With Bright Blue Coating High Strength 0.01mm Silver Core Bonding Wire For Semiconductor And 5G Device Assembly

Applications: Electronics, Automotive, Aerospace

Coating: Palladium

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Good price High Purity Ultra Fine Gold Bonding Wire of 0.01mm Diameter for Microscale Electronics online Video

High Purity Ultra Fine Gold Bonding Wire of 0.01mm Diameter for Microscale Electronics

Purity: 99.99%

Material: Gold

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Good price Customizable Ultra Fine Gold Bonding Wire for Inner Lead Packaging in Integrated Circuits and Semiconductor Separators online Video

Customizable Ultra Fine Gold Bonding Wire for Inner Lead Packaging in Integrated Circuits and Semiconductor Separators

Density: 19.34 G/cm3

Purity: 99.99%

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Good price Silver Bonding Wire With Composite Material Treatment For Performance in Servers Systems online Video

Silver Bonding Wire With Composite Material Treatment For Performance in Servers Systems

Diameter: 18(0.7mil)

Breaking Load BL(gf): >4

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Good price Aluminum Bonding Wire For Power Semiconductors In Automotive Computing Equipment online Video

Aluminum Bonding Wire For Power Semiconductors In Automotive Computing Equipment

Diameter: 0.01mm - 0.5mm

Elongation EL(%): 3-20

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