Extreme bond reliability Ultra Fine Gold Bonding Wire for for various applications
Discover our Ultra Fine Gold Bonding Wire, engineered for extreme bond reliability across various applications. This wire stands out for its top - notch quality and versatility. Its ultra - fine design allows for precise connections, essential in delicate electronic setups.
Whether it's in the electronics, medical device, or aerospace industries, our gold bonding wire delivers consistent performance. It ensures strong and durable bonds, reducing the risk of connection failures. Count on it for high - precision, reliable bonding solutions that meet the demands of diverse and critical applications.
Winner offers a wide selection of ball, wedge and stud bonding wires in a varied portfolio of 4N 99.99 / 3N 99.9 / 2N 99.0.
* Raw materials of high purity (99,999 %)
* Stable mechancial qualities
* Wire surface of high quality
* Made according to customer specifications
* With a diameter down to a size of 0.6 mils / 15 microns for very fine applications.
* For ball or wedge bonding or stud bumping
The gold bonding wire is a kind of material for semiconductor packaging which has excellent electrical conductivity, thermal conductivity, mechanical properties, and chemical stability. This product is used as an inner lead for packaging and is one of the essential materials in the manufacturing process of integrated circuits and semiconductor separators. Winner can provide Au bonding wire with different wire diameters from 13um-50um according to customer requirements.
Our comprehensive in-house capabilities, which encompass casting, drawing, annealing, and A2LA-accredited analytical methods, guarantee the delivery of homogeneous, high-purity wire. This wire not only features ultra-clean surfaces but also a smooth finish, making it ideal for various applications.
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Density:
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19.34 g/cm3
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Melting Point:
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1063°C
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Electrical Resistivity: (@20°C)
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2.3 μΩ-cm
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Electrical Conductivity: (@20°C)
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75% (IACS)
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Thermal Conductivity: (@20°C)
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315 W/(m-K)
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Fusing Current (10 mm x 25 μm)
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0.52 A
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We take pride in offering a complete range of wire diameters, thereby fulfilling the diverse needs for strength and elongation in different wire applications. Moreover, we collaborate closely with our customers to provide customized solutions. In these custom solutions, technical parameters such as tensile strength and elongation are meticulously tailored to meet their specific requirements. This customer-centric approach enables us to not only meet but exceed the expectations of our clients in the highly competitive market of wire manufacturing and bonding applications.
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Composition
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Diameter
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Tensile Strength (gms)
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Elongation (%)
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99.99% Au
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0.7 mil
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17.5 μm
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3 - 10
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2 - 6
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0.8 mil
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20 μm
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4 - 13
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2 - 7
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0.9 mil
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22.5 μm
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5 - 16
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2 - 8
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1.0 mil
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25 μm
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6 - 20
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2 - 8
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1.3 mil
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32.5 μm
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10 - 45
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2 - 10
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1.5 mil
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37.5 μm
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13 - 50
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2 - 12
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1.7 mil
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42.5 μm
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15 - 60
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2 - 12
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1.8 mil
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45 μm
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20 - 70
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2 - 12
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2.0 mil
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50 μm
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25 - 85
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2 - 15
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3.0 mil
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75 μm
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50 - 180
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2 - 20
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Why Gold Bonding Wire?
Gold (Au) bonding wire is used in a wide range of applications rangining from high pin-count, ultra-fine pitch microelectronic devices to high-power discrete components. Au is the preferred choice of bonding material when a) the contact material is not compatible with Aluminum (Al) and/or Copper (Cu) b) the contact area is limited c) the device will be subject to high temperature or high humidity environments.
The Advantages of Gold Bonding Wire:
• Extreme bond reliability
• A wide processing window
• Low-impact ball and wedge bonding
• Superior looping performance
• High tensile test performance
• Excellent corrosion resistance
• Higher fusing current than standard Al bond wire.
1.What kind of Enameled copper wire do Winner produce?
We focus on research and development of selfbonding magnet round copper wire, fine polyurethane magnet wire, selfbonding litz copper wire and selfbonding silk covered wire.
2.What's diameters available of the Enamelled copper wire ?
We specialize in fine and ultra fine enamelled copper wire,diameters available of our products is Φ0.018-0.50mm.
3.What's selfbonding enameled copper wire?
Selfbonding enamelled copper wire is a special type of enamelled wire with an additional adhesive enamel overcoat such as thermoplastic resin.This adhesive has a bonding feature, which is activated
by heat or solvents.
Once activated the adhesive bonds turn to turn windings into a compact self supporting coil.
The use of selfbonding wire may offer cost and manufacturing advantages in some winding applications
as bobbins, tape, varnishing, or impregnation may be eliminated.
4. Is possible to get any sample of selfbonding enamelled copper wire that you have in production?
Of course you can!
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