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99.99% Pure BeCu Bonding Wire 0.01-0.4mm for Semiconductor Packaging

99.99% Pure BeCu Bonding Wire 0.01-0.4mm for Semiconductor Packaging

Semiconductor Packaging Bonding Wire

99.99% Pure BeCu Bonding Wire

0.01-0.4mm BeCu Bonding Wire

Place of Origin:

CHINA

Brand Name:

WINNER

Certification:

ISO9100

Model Number:

BC001

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Product Details
Purity:
99.99%
Bonding Method:
Ultrasonic, Thermocompression, Laser
Product Type:
Bonding Wire
Diameter:
0.01-0.4mm
Length Meters:
500/1000
Thermal Conductivity:
318 W/mK
Application:
Semiconductor Packaging
Package:
Spool, Reel, Coil
Flexibility:
High
Package Weight:
2.2 Pounds
Electrical Conductivity:
45.5 MS/m
Tensile Strength:
100 Ksi
Melting Point:
1064°C
Density:
8.96 G/cm3
Wire Diameter:
0.001 Inches
Coating Thickness:
0.001mm
Material:
Copper
Coating:
Gold
Corrosion Resistance:
High
Purity:
99.999%
Bonding Method:
Ultrasonic
Temperature Range:
-40°C To 200°C
Surface Finish:
Bright
Conductivity:
98%
Package Size:
100 Meters
Bond Strength:
High
Package:
Spool
Coating:
Berullium
Highlight:

Semiconductor Packaging Bonding Wire

,

99.99% Pure BeCu Bonding Wire

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0.01-0.4mm BeCu Bonding Wire

Payment & Shipping Terms
Minimum Order Quantity
1PC
Price
999
Packaging Details
Roll, Neutrial Packing or with OEM LOGO
Delivery Time
5-8 WORKING DAYS
Payment Terms
L/C, Western Union, T/T Supply Ability
Supply Ability
100000 rolls per month
Product Description

Product Description

Our Ultra-fine Coated Beryllium Copper (BeCu) Wire is designed for applications requiring exceptional electrical conductivity, superior thermal performance, and high mechanical strength in a compact form factor.
With diameters as small as 0.015mm, this wire combines the strength of beryllium copper with the protective benefits of advanced surface coatings, ensuring long-term stability and resistance to oxidation, corrosion, and wear.

Produced under strict quality control in an ISO-certified facility, this wire is widely used in precision electronics, high-frequency connectors, aerospace, medical devices, and miniature spring contacts. Its excellent fatigue resistance and high resilience make it ideal for demanding environments where consistent performance is critical.


Key Features & Benefits

Ultra-fine Diameter Range: 0.015mm–0.2mm for micro-scale applications

Outstanding Electrical Conductivity: Copper-rich alloy ensures fast, stable signal transmission

Excellent Thermal Performance: Effective heat dissipation for high-load applications

High Mechanical Strength: Beryllium copper core provides superior durability and elasticity

Protective Coating: Enhances corrosion resistance and prolongs service life

Customizable Specifications: Diameter, coating material, and spool size tailored to your needs


Applications

High-frequency connectors and coaxial cables

Semiconductor test probes and contact springs

Precision electrical instruments and sensors

Aerospace and defense electronics

Medical device wiring and miniature actuators


Technical Specifications

Material: High-strength beryllium copper alloy with protective coating (Ni, Pd, Au, etc.)

Purity: Cu ≥ 99%

Diameter Range: 0.015mm–0.2mm (custom sizes available)

Tensile Strength: ≥ 1,000 MPa (varies by size)

Elongation: ≥ 2%

Surface Coating Thickness: As per customer requirements

Packaging: Cleanroom-grade spools, moisture-proof sealed packing


99.99% Pure BeCu Bonding Wire 0.01-0.4mm for Semiconductor Packaging 0


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