Product Type: Bonding Wire
Wire Diameter: 0.001 Inches
Material: Beryllium Copper
Machining Property: Good
Material: Beryllium Copper
Machining Property: Good
Material: Beryllium Copper
Machining Property: Good
Material: Beryllium Copper
Machining Property: Good
Surface Treatment: Bright, Oxidized, Tin Plated
Application: Springs, Connectors, Switches, Electrical Contacts
Surface Treatment: Bright, Oxidized, Tin Plated
Application: Springs, Connectors, Switches, Electrical Contacts
Surface Treatment: Bright, Oxidized, Tin Plated
Application: Springs, Connectors, Switches, Electrical Contacts
Heat Treatment: 3 Hr 315C-330C
Melting Point: 870-980°C
Application: Wire Bonding
Package: Spool
Application: Wire Bonding
Package: Spool
Application: Wire Bonding
Package: Spool
Application: Wire Bonding
Package: Spool
Application: Wire Bonding
Package: Spool
Diameter: 0.01mm - 0.4mm
Availability: Custom Sizes Available
Application: Wire Bonding
Bond Strength: High
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