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Home > Products > Gold Plated Silver Wire >
High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics

High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics

High Conductivity Bonding Wire

High Bond Strength Gold Plated Silver Wire

Smooth Surface Finish Spooled Wire

Place of Origin:

China

Brand Name:

WINNER

Certification:

ISO9100

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High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics
High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics
Product Details
Coating:
Gold
Bond Strength:
High
Certifications:
ISO 9001
Corrosion Resistance:
High
Elongation:
3-20%
Product Type:
Bonding Wire
Surface Finish:
Smooth, Matte, Textured
Diameter:
0.7-1.0mil
Material:
Gold, Silver
Purity:
99.99%
Highlight:

High Conductivity Bonding Wire

,

High Bond Strength Gold Plated Silver Wire

,

Smooth Surface Finish Spooled Wire

Payment & Shipping Terms
Minimum Order Quantity
1000m
Price
999
Packaging Details
Roll, Neutrial Packing or with OEM LOGO
Delivery Time
5-8 days
Payment Terms
T/T,D/A,Western Union
Supply Ability
9999999
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Product Description
High Conductivity Gold Plated Silver Wire on Spool
Factory Supply Ultra Fine Gold Plated Silver Wire
Gold Plated Silver Spooled Wire combines the high conductivity of silver with the corrosion resistance of gold, making it ideal for scientific research and laboratory use. This specialized wire is engineered for demanding applications where signal integrity must be maintained under extreme conditions.
Key Applications
  • Cryogenic systems and superconducting circuits
  • High-frequency RF and microwave assemblies
  • Quantum computing research
  • Particle detection systems
  • Photonics instrumentation
  • Materials science research
  • Aerospace testing applications
  • Precision engineering projects
  • Advanced sensor development
Product Advantages
  • Superior conductivity with low contact resistance
  • Excellent corrosion resistance from gold plating
  • Consistent signal transmission in extreme environments
  • Spooled format for precise handling in clean rooms
  • Ideal for research setups and laboratory applications
Product Images
High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 0 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 1 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 2 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 3 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 4 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 5
Tags：

Ultra Fine Gold Plated Silver Wire

High Purity gold plated silver wire

gold plated silver wire

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Tel：86-158-1857-6616
Email：sales@winner-sc.com
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Sichuan WINNER Special Electronic Materials Co., Ltd. focuses on ultra-fine coated metal wire for semiconductor packaging. Winner is a global leader!
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