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Home > Products > Bonding Wire >
1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging

1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging

1.0mil Gold Wire

High Purity 99.99% Bonding Wire

Corrosion Resistant Au Wire

Place of Origin:

CHINA

Brand Name:

WINNER

Certification:

ISO9100

Model Number:

MW001

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1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging
1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging 1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging 1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging 1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging 1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging 1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging 1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging
Product Details
Application:
Semiconductor Packaging, Microelectronics, Medical Devices
Package:
Spool
Corrosion Resistance:
High
Material:
Gold
Length Meters:
500/1000
Product Type:
Bonding Wire
Coating:
Gold
Bonding Method:
Ultrasonic
Temperature Range:
-40°C To 200°C
Surface Finish:
Bright
Conductivity:
98%
Highlight:

1.0mil Gold Wire

,

High Purity 99.99% Bonding Wire

,

Corrosion Resistant Au Wire

Payment & Shipping Terms
Minimum Order Quantity
1PC
Price
999
Packaging Details
Roll, Neutrial Packing or with OEM LOGO
Delivery Time
5-8 WORKING DAYS
Payment Terms
L/C,Western Union,T/T
Supply Ability
100000 rolls per month
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Product Description
1.0mil Bonding Gold Wire for IC/LED Applications
Gold Bonding Wire Au99.99% - 100m Per Spool (0.025mm Diameter). High purity 99.99% (4N) fine gold wire for scientific research, medical, aerospace, and electrical applications. Offers excellent electrical properties and low reactivity for stability in harsh environments.
Material Gold
Diameter 0.0125, 0.05, etc. mm
Form Wire
Purity ≥99.99%
The main body is pure gold (Au > 99.999%), with added beryllium, rare earth and other trace elements. Manufactured through smelting, wire drawing, and heat treatment processes to achieve different properties, meeting various gold wire requirements. Gold bonding wire offers the highest stability among all bonding wires.
Medical Applications
  • Electrosurgery equipment
  • Guide wires and stents
  • Life-support devices
  • Medical markers for X-rays (provides radiopacity)
  • CV therapies
  • In vitro diagnostic devices
Aerospace Applications
  • Wire-wound potentiometers
  • Aerospace instrumentation (avionics)
  • Radio communication equipment
  • Temperature regulation sensors
Electrical Applications
  • Imaging devices and televisions
  • Smartphones and computers
  • LED technology
  • Orthodontic appliances
  • Wire bonding for integrated circuits
  • Motherboard connections and microprocessor mounting
Product Images
1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging 0
1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging 1
1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging 2
1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging 3
Tags：

Aluminum Bonding Wire

wire bond wire

aluminium bonding wire

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