Home
Products
Bonding Wire
Gold Plated Tungsten Wire
Gold Plated Copper Wire
Gold Plated Molybdenum Wire
Tungsten Wire
Gold Plated Silver Wire
Palladium Coated Copper Wire
Ultra Fine Copper Wire
Beryllium Copper Wire
Spring Test Probes
Gold Electroplating Service
Videos
About Us
Company Profile
Factory Tour
Quality Control
Contact Us
events
news
Cases
english
english
français
Deutsch
Italiano
Русский
Español
português
Nederlandse
ελληνικά
日本語
한국
العربية
हिन्दी
Türkçe
bahasa indonesia
tiếng Việt
ไทย
বাংলা
فارسی
polski
Home > Products > Bonding Wire >
0.025mm Diameter Gold Bonding Wire for Semiconductor Packaging and Microelectronics Applications

0.025mm Diameter Gold Bonding Wire for Semiconductor Packaging and Microelectronics Applications

0.025mm Diameter Gold Bonding Wire

Semiconductor Packaging Au Wire

Microelectronics Bonding Wire

Place of Origin:

CHINA

Brand Name:

WINNER

Certification:

ISO9100

Model Number:

MW001

Contact Us
Request A Quote
0.025mm Diameter Gold Bonding Wire for Semiconductor Packaging and Microelectronics Applications
0.025mm Diameter Gold Bonding Wire for Semiconductor Packaging and Microelectronics Applications 0.025mm Diameter Gold Bonding Wire for Semiconductor Packaging and Microelectronics Applications 0.025mm Diameter Gold Bonding Wire for Semiconductor Packaging and Microelectronics Applications 0.025mm Diameter Gold Bonding Wire for Semiconductor Packaging and Microelectronics Applications 0.025mm Diameter Gold Bonding Wire for Semiconductor Packaging and Microelectronics Applications 0.025mm Diameter Gold Bonding Wire for Semiconductor Packaging and Microelectronics Applications
Product Details
Application:
Semiconductor Packaging, Microelectronics, Medical Devices
Package:
Spool
Corrosion Resistance:
High
Material:
Gold
Length Meters:
500/1000
Product Type:
Bonding Wire
Coating:
Gold
Bonding Method:
Ultrasonic
Temperature Range:
-40°C To 200°C
Surface Finish:
Bright
Conductivity:
98%
Highlight:

0.025mm Diameter Gold Bonding Wire

,

Semiconductor Packaging Au Wire

,

Microelectronics Bonding Wire

Payment & Shipping Terms
Minimum Order Quantity
1PC
Price
999
Packaging Details
Roll, Neutrial Packing or with OEM LOGO
Delivery Time
5-8 WORKING DAYS
Payment Terms
L/C,Western Union,T/T
Supply Ability
100000 rolls per month
RELATED PRODUCTS
Good price 99.99% Pure Gold Bonding Wire 0.015mm 0.018mm 0.02mm 0.025mm 0.03mm online Video

99.99% Pure Gold Bonding Wire 0.015mm 0.018mm 0.02mm 0.025mm 0.03mm

Get Best Price
Good price 0.025mm Diameter Gold Bonding Wire for Semiconductor Packaging and Microelectronics Applications online Video

0.025mm Diameter Gold Bonding Wire for Semiconductor Packaging and Microelectronics Applications

Get Best Price
Good price 1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging online Video

1.0mil High Purity 99.99% Gold Bonding Wire with Corrosion Resistance for Semiconductor Packaging

Get Best Price
Good price 9999 Pure 0.03mm Round Gold Bonding Wire for Semiconductor Packaging Microelectronics and Medical Devices online Video

9999 Pure 0.03mm Round Gold Bonding Wire for Semiconductor Packaging Microelectronics and Medical Devices

Get Best Price
Contact Us
Contact Now
Product Description
Gold Bonding Wire Widely Used in Electronic Components for IC/LED
Gold Bonding Wire Au99.99% - 100m Per Spool (0.025mm Diameter). High purity 99.99% (4N) fine gold wire for scientific research, medical, aerospace, and electrical applications. Offers excellent electrical properties and low reactivity for stability in harsh environments.
Material Gold
Diameter 0.0125, 0.05, etc. mm
Form Wire
Purity ≥99.99%
Gold wire provides exceptional electrical conductivity and durability, making it ideal for precision applications requiring stability in demanding conditions. Available in round or ribbon form, pure or mixed with beryllium for semiconductor applications.
Medical Applications
  • Electrosurgery equipment
  • Guide wires and stents
  • Life-support devices
  • Medical markers for X-rays (provides radiopacity)
  • CV therapies
  • In vitro diagnostic devices
Aerospace Applications
  • Wire-wound potentiometers
  • Aerospace instrumentation (avionics)
  • Radio communication equipment
  • Temperature regulation sensors
Electrical Applications
  • Imaging devices and televisions
  • Smartphones and computers
  • LED technology
  • Orthodontic appliances
  • Wire bonding for integrated circuits
  • Motherboard connections and microprocessor mounting
Product Images
0.025mm Diameter Gold Bonding Wire for Semiconductor Packaging and Microelectronics Applications 0
0.025mm Diameter Gold Bonding Wire for Semiconductor Packaging and Microelectronics Applications 1
0.025mm Diameter Gold Bonding Wire for Semiconductor Packaging and Microelectronics Applications 2
0.025mm Diameter Gold Bonding Wire for Semiconductor Packaging and Microelectronics Applications 3
Tags：

Aluminum Bonding Wire

wire bond wire

aluminium bonding wire

Send your inquiry directly to us

Tel：86-158-1857-6616
Email：sales@winner-sc.com
About us
Company Profile
Factory Tour
Quality Control
Sitemap
Events
news
Cases
SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
Sichuan WINNER Special Electronic Materials Co., Ltd. focuses on ultra-fine coated metal wire for semiconductor packaging. Winner is a global leader!
We'll get back to you as soon as possible.
Privacy Policy China Good Quality Bonding Wire Supplier. Copyright © 2024-2025 SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD. . All Rights Reserved.