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Home > Products > Bonding Wire >
4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs

4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs

4N purity gold bonding wire

25µm gold bonding wire

research lab bonding wire

Place of Origin:

CHINA

Brand Name:

WINNER

Certification:

ISO9100

Model Number:

MW001

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4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs
4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs 4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs 4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs 4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs 4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs
Product Details
Application:
Semiconductor Packaging, Microelectronics, Medical Devices
Package:
Spool
Corrosion Resistance:
High
Material:
Gold
Length Meters:
500/1000
Product Type:
Bonding Wire
Coating:
Gold
Bonding Method:
Ultrasonic
Temperature Range:
-40°C To 200°C
Surface Finish:
Bright
Conductivity:
98%
Highlight:

4N purity gold bonding wire

,

25µm gold bonding wire

,

research lab bonding wire

Payment & Shipping Terms
Minimum Order Quantity
1PC
Price
999
Packaging Details
Roll, Neutrial Packing or with OEM LOGO
Delivery Time
5-8 WORKING DAYS
Payment Terms
L/C,Western Union,T/T
Supply Ability
100000 rolls per month
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Product Description
4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs 0
High Purity Gold > 99.99% (4N).  Designed specifically for wire bonding. Gold bonding wire is used to connect electrical components in many industries, including electronics, aerospace and medicine.  Gold bonding wire has excellent electrical conductivity, stability and resistance to corrosion.  It is an important material in semiconductor and electronic device manufacturing.  It is commonly used for wire bonding to electrically connect microchip semiconductor dies to the terminals of a chip package or directly to a substrate.  Commonly used by integrated circuit (IC) packaging shops, research labs and advanced manufacturing facilities. 
Features
  • Designed specifically for wire bonding
  • Au100 alloy
  • 1,064°C (1,947°F) melting point
  • Lead-free, RoHS 3 compliant, and REACH compliant
  • 100m (328 feet) length
  • >12 months shelf life
  • 4N (>99.99%) purity
  • 950mg wire weight
4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs 1 4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs 2 4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs 3 4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs 4
Tags：

Aluminum Bonding Wire

wire bond wire

aluminium bonding wire

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