Home
Products
Bonding Wire
Gold Plated Tungsten Wire
Gold Plated Copper Wire
Gold Plated Molybdenum Wire
Tungsten Wire
Gold Plated Silver Wire
Palladium Coated Copper Wire
Ultra Fine Copper Wire
Beryllium Copper Wire
Spring Test Probes
Gold Electroplating Service
Videos
About Us
Company Profile
Factory Tour
Quality Control
Contact Us
events
news
Cases
english
english
français
Deutsch
Italiano
Русский
Español
português
Nederlandse
ελληνικά
日本語
한국
العربية
हिन्दी
Türkçe
indonesia
tiếng Việt
ไทย
বাংলা
فارسی
polski
Home > Products > Bonding Wire >
30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor

30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor

30 μm gold bonding wire

high-reliability semiconductor bonding wire

fine-pitch wire bonding wire

Place of Origin:

CHINA

Brand Name:

WINNER

Certification:

ISO9100

Model Number:

MW001

Contact Us
Request A Quote
30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor
30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor 30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor 30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor 30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor
Product Details
Application:
Semiconductor Packaging, Microelectronics, Medical Devices
Package:
Spool
Corrosion Resistance:
High
Material:
Gold
Length Meters:
500/1000
Product Type:
Bonding Wire
Coating:
Gold
Bonding Method:
Ultrasonic
Temperature Range:
-40°C To 200°C
Surface Finish:
Bright
Conductivity:
98%
Highlight:

30 μm gold bonding wire

,

high-reliability semiconductor bonding wire

,

fine-pitch wire bonding wire

Payment & Shipping Terms
Minimum Order Quantity
1PC
Price
999
Packaging Details
Roll, Neutrial Packing or with OEM LOGO
Delivery Time
5-8 WORKING DAYS
Payment Terms
L/C,Western Union,T/T
Supply Ability
100000 rolls per month
RELATED PRODUCTS
Good price Conductivity stabilty 18µm (0.7mil) Gold Bonding WIRE applycation in Aerospace online Video

Conductivity stabilty 18µm (0.7mil) Gold Bonding WIRE applycation in Aerospace

Get Best Price
Good price 4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs online Video

4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs

Get Best Price
Good price Ultra Fine 23µm (0.9mil) Gold Wire For Packaging Shops online Video

Ultra Fine 23µm (0.9mil) Gold Wire For Packaging Shops

Get Best Price
Good price Gold Bonding Wire For Semiconductor Applications online Video

Gold Bonding Wire For Semiconductor Applications

Get Best Price
CONTACT US
Contact Now
Product Description
30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor 0
30µm (1.2mil) gold wire is widely used in aerospace components requiring higher current load, stronger mechanical strength, and better vibration resistance. This article focuses on the conductivity stability of 18µm (0.7mil) gold bonding wire, its advantages, and typical applications in aerospace—for engineers, purchasers, and R&D teams seeking high‑reliability bonding solutions.
Features
  • Designed specifically for wire bonding
  • Au100 alloy
  • 1,064°C (1,947°F) melting point
  • Lead-free, RoHS 3 compliant, and REACH compliant
  • 100m (328 feet) length
  • >12 months shelf life
  • 4N (>99.99%) purity
  • 950mg wire weight
30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor 1 30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor 2 30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor 3 30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor 4
Tags：

Aluminum Bonding Wire

wire bond wire

aluminium bonding wire

Send your inquiry directly to us

Tel：86-158-1857-6616
Email：sales@winner-sc.com
About Us
Company Profile
Factory Tour
Quality Control
Sitemap
Events
news
Cases
SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
Sichuan WINNER Special Electronic Materials Co., Ltd. focuses on ultra-fine coated metal wire for semiconductor packaging. Winner is a global leader!
We'll get back to you as soon as possible.
Privacy Policy China Good Quality Bonding Wire Supplier. Copyright © 2024-2026 SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD. . All Rights Reserved.