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Home > Products > Bonding Wire >
30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor

30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor

30 μm gold bonding wire

high-reliability semiconductor bonding wire

fine-pitch wire bonding wire

Place of Origin:

CHINA

Brand Name:

WINNER

Certification:

ISO9100

Model Number:

MW001

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30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor
30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor 30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor 30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor 30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor
Product Details
Application:
Semiconductor Packaging, Microelectronics, Medical Devices
Package:
Spool
Corrosion Resistance:
High
Material:
Gold
Length Meters:
500/1000
Product Type:
Bonding Wire
Coating:
Gold
Bonding Method:
Ultrasonic
Temperature Range:
-40°C To 200°C
Surface Finish:
Bright
Conductivity:
98%
Highlight:

30 μm gold bonding wire

,

high-reliability semiconductor bonding wire

,

fine-pitch wire bonding wire

Payment & Shipping Terms
Minimum Order Quantity
1PC
Price
999
Packaging Details
Roll, Neutrial Packing or with OEM LOGO
Delivery Time
5-8 WORKING DAYS
Payment Terms
L/C,Western Union,T/T
Supply Ability
100000 rolls per month
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Product Description
30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor 0
30µm (1.2mil) gold wire is widely used in aerospace components requiring higher current load, stronger mechanical strength, and better vibration resistance. This article focuses on the conductivity stability of 18µm (0.7mil) gold bonding wire, its advantages, and typical applications in aerospace—for engineers, purchasers, and R&D teams seeking high‑reliability bonding solutions.
Features
  • Designed specifically for wire bonding
  • Au100 alloy
  • 1,064°C (1,947°F) melting point
  • Lead-free, RoHS 3 compliant, and REACH compliant
  • 100m (328 feet) length
  • >12 months shelf life
  • 4N (>99.99%) purity
  • 950mg wire weight
Close-up view of high purity gold wire showing plating quality and surface texture Gold wire spool showing professional packaging and product storage Microscopic cross-section view of gold wire showing uniform structure and purity Gold wire being used in precision industrial application with specialized equipment
Tags：

Aluminum Bonding Wire

wire bond wire

aluminium bonding wire

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Email：sales@winner-sc.com
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Sichuan WINNER Special Electronic Materials Co., Ltd. focuses on ultra-fine coated metal wire for semiconductor packaging. Winner is a global leader!
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