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Home > Products > Bonding Wire >
Ag Alloy Bonding Wire For Semiconductor Devices

Ag Alloy Bonding Wire For Semiconductor Devices

Ag alloy semiconductor bonding wire

bonding wire for semiconductor devices

silver alloy bonding wire

Place of Origin:

CHINA

Brand Name:

WINNER

Certification:

ISO9100

Model Number:

MW001

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Request A Quote
Ag Alloy Bonding Wire For Semiconductor Devices
Ag Alloy Bonding Wire For Semiconductor Devices Ag Alloy Bonding Wire For Semiconductor Devices Ag Alloy Bonding Wire For Semiconductor Devices
Product Details
Product Type:
Bonding Wire
Material:
Ag
Package:
Spool
Surface Finish:
Bright
Conductivity:
98%
Application:
Semiconductor Packaging, Microelectronics, Medical Devices
Highlight:

Ag alloy semiconductor bonding wire

,

bonding wire for semiconductor devices

,

silver alloy bonding wire

Payment & Shipping Terms
Minimum Order Quantity
1PC
Price
999
Packaging Details
Roll, Neutrial Packing or with OEM LOGO
Delivery Time
5-8 WORKING DAYS
Payment Terms
L/C,Western Union,T/T
Supply Ability
100000 rolls per month
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Product Description
Product Description 
Silver (Ag) alloy bonding wires have excellent electrical and thermal conductivity. They are also effective wires for optical semiconductor devices such as LEDs as they have high reflectivity in the visible spectrum. In addition, as an alternative material for gold (Au) wires, costs can be reduced by approximately 80%.
Features
  • Reduce material cost with good bondability
  • High reflectivity in short wavelength range
  • Low Resistivity (SEC Type)
  • Soft FAB (SEC type)
Ag Alloy Bonding Wire For Semiconductor Devices 0 Ag Alloy Bonding Wire For Semiconductor Devices 1 Ag Alloy Bonding Wire For Semiconductor Devices 2 Ag Alloy Bonding Wire For Semiconductor Devices 3
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Aluminum Bonding Wire

wire bond wire

aluminium bonding wire

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Sichuan WINNER Special Electronic Materials Co., Ltd. focuses on ultra-fine coated metal wire for semiconductor packaging. Winner is a global leader!
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