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Home > Products > Bonding Wire >
0.01mm Ultra Fine Silver Bonding Wire High Strength Semiconductor Interconnect Wire

0.01mm Ultra Fine Silver Bonding Wire High Strength Semiconductor Interconnect Wire

ultra fine silver bonding wire

high strength semiconductor wire

0.01mm bonding wire with warranty

Place of Origin:

CHINA

Brand Name:

WINNER

Certification:

ISO9100

Model Number:

MW001

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0.01mm Ultra Fine Silver Bonding Wire High Strength Semiconductor Interconnect Wire
0.01mm Ultra Fine Silver Bonding Wire High Strength Semiconductor Interconnect Wire 0.01mm Ultra Fine Silver Bonding Wire High Strength Semiconductor Interconnect Wire 0.01mm Ultra Fine Silver Bonding Wire High Strength Semiconductor Interconnect Wire
Product Details
Product Type:
Bonding Wire
Material:
Ag
Package:
Spool
Surface Finish:
Bright
Conductivity:
98%
Application:
Semiconductor Packaging, Microelectronics, Medical Devices
Highlight:

ultra fine silver bonding wire

,

high strength semiconductor wire

,

0.01mm bonding wire with warranty

Payment & Shipping Terms
Minimum Order Quantity
1PC
Price
999
Packaging Details
Roll, Neutrial Packing or with OEM LOGO
Delivery Time
5-8 WORKING DAYS
Payment Terms
L/C,Western Union,T/T
Supply Ability
100000 rolls per month
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Product Description
0.01mm Ultra Fine Silver Bonding Wire High Strength Semiconductor Interconnect Wire

High tensile strength, not easy to break, widely used as connecting wire for common semiconductor devices.
Product Description 
Silver (Ag) alloy bonding wires have excellent electrical and thermal conductivity. They are also effective wires for optical semiconductor devices such as LEDs as they have high reflectivity in the visible spectrum. In addition, as an alternative material for gold (Au) wires, costs can be reduced by approximately 80%.
Features
  • Reduce material cost with good bondability
  • High reflectivity in short wavelength range
  • Low Resistivity (SEC Type)
  • Soft FAB (SEC type)
0.01mm Ultra Fine Silver Bonding Wire High Strength Semiconductor Interconnect Wire 0 0.01mm Ultra Fine Silver Bonding Wire High Strength Semiconductor Interconnect Wire 1 0.01mm Ultra Fine Silver Bonding Wire High Strength Semiconductor Interconnect Wire 2 0.01mm Ultra Fine Silver Bonding Wire High Strength Semiconductor Interconnect Wire 3
Tags：

Aluminum Bonding Wire

wire bond wire

aluminium bonding wire

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Tel：86-158-1857-6616
Email：sales@winner-sc.com
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Sichuan WINNER Special Electronic Materials Co., Ltd. focuses on ultra-fine coated metal wire for semiconductor packaging. Winner is a global leader!
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