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0.02mm Ultra Fine Ag Wire Anti-Corrosion for Industrial Semiconductor Modules

0.02mm Ultra Fine Ag Wire Anti-Corrosion for Industrial Semiconductor Modules

ultra fine ag bonding wire

anti-corrosion semiconductor bonding wire

industrial ag wire for modules

Place of Origin:

CHINA

Brand Name:

WINNER

Certification:

ISO9100

Model Number:

MW001

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Product Details
Product Type:
Bonding Wire
Material:
Ag
Package:
Spool
Surface Finish:
Bright
Conductivity:
98%
Application:
Semiconductor Packaging, Microelectronics, Medical Devices
Highlight:

ultra fine ag bonding wire

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anti-corrosion semiconductor bonding wire

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industrial ag wire for modules

Payment & Shipping Terms
Minimum Order Quantity
1PC
Price
999
Packaging Details
Roll, Neutrial Packing or with OEM LOGO
Delivery Time
5-8 WORKING DAYS
Payment Terms
L/C,Western Union,T/T
Supply Ability
100000 rolls per month
Product Description
0.02mm Ultra Fine Ag Wire Anti-Corrosion for Industrial Semiconductor Modules

Durable anti-corrosion property, long service life for industrial semiconductor integrated modules.
Product Description 
Silver (Ag) alloy bonding wires have excellent electrical and thermal conductivity. They are also effective wires for optical semiconductor devices such as LEDs as they have high reflectivity in the visible spectrum. In addition, as an alternative material for gold (Au) wires, costs can be reduced by approximately 80%.
Features
  • Reduce material cost with good bondability
  • High reflectivity in short wavelength range
  • Low Resistivity (SEC Type)
  • Soft FAB (SEC type)
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