Place of Origin:
China
Brand Name:
Winner
Certification:
COC
Precision Materials. Reliable Contact. Customized Innovation.
At Sichuan Winner Special Electronic Materials Co., Ltd., we believe that every reliable electrical connection begins with the right material.
We specialize in precision specialty metal wire solutions for semiconductor test probes, probe card components, microelectronics, and advanced electronic testing applications.
Our product portfolio includes Gold-Plated Tungsten Wire, Gold-Plated Molybdenum Wire, Gold-Plated Tungsten-Rhenium Alloy Wire, and other specialty metal wire materials for precision electrical contact applications.
By combining high-performance metal cores with precision surface coating technologies, we aim to provide materials that meet the demanding requirements of modern semiconductor testing.
We don't just supply metal wires. We help develop customized material solutions for your unique testing applications.
Combining the high hardness, mechanical strength, and dimensional stability of tungsten with the excellent conductivity and corrosion resistance of a gold-plated surface.
Key Features:
High mechanical strength and rigidity
Excellent surface conductivity
Good corrosion resistance
Precision wire diameter
Customizable gold-plating thickness
Potential Applications: Semiconductor test probes, probe card components, and precision electrical contacts.
Gold-plated molybdenum wire combines the mechanical properties of molybdenum with the conductive and protective characteristics of a gold surface.
Key Features:
Good mechanical strength
Dimensional stability
Conductive gold-plated surface
Fine-diameter wire options
Customized coating requirements
Potential Applications: Precision test probes, miniature electronic components, and specialized electrical contacts.
Tungsten-rhenium alloy wire offers high strength and useful mechanical properties for demanding precision applications.
The gold-plated surface provides additional corrosion protection and supports electrical contact performance.
Key Features:
High-strength tungsten-rhenium alloy core
Good dimensional stability
Gold-plated conductive surface
Customizable alloy composition, subject to feasibility
Application-specific mechanical properties
Potential Applications: Semiconductor testing components, precision probe materials, and specialized electronic contacts.
For applications requiring non-standard specifications, Sichuan Winner welcomes opportunities to evaluate customized specialty metal wire solutions.
Customization may include wire diameter, material selection, surface coating, mechanical properties, and packaging requirements.
| Parameter | Description |
|---|---|
| Product Category | Semiconductor Test Probe Materials |
| Brand | Sichuan Winner |
| Materials | Tungsten, Molybdenum, Tungsten-Rhenium Alloy |
| Surface Treatment | Gold Plating / Customized |
| Wire Diameter | According to Product Specifications |
| Plating Thickness | Customizable |
| Diameter Tolerance | According to Agreed Requirements |
| Tensile Strength | Application-Specific |
| Elongation | Customized Requirements |
| Surface Quality | Precision Surface Finish |
| Packaging | Spool / Customized Packaging |
| R&D Support | Technical Evaluation & Development |
| OEM Customization | Subject to Technical Feasibility |
High Mechanical Strength
Suitable metal core materials provide strength and dimensional stability for precision probe manufacturing.
Excellent Surface Conductivity
Gold plating offers a highly conductive surface that can support reliable electrical contact.
Corrosion Resistance
Gold-coated surfaces help protect against corrosion and environmental degradation under suitable operating conditions.
Precision Dimensions
Fine wire dimensions support the development of miniature electronic testing components.
Flexible Customization
Material properties and coating specifications can be tailored according to customer requirements and manufacturing feasibility.
Your Challenges. Our Research. Your Precision Solution.
At Sichuan Winner, we understand that semiconductor testing technology continues to evolve, creating new demands for precision materials.
Our R&D-oriented approach focuses on technical communication, material selection, process evaluation, and application-specific product development.
Our technical development priorities include:
Ultra-Fine Wire Development
Exploring fine-diameter wire solutions for miniature semiconductor testing components.
Precious Metal Plating Technology
Evaluating gold-plating thickness, coating adhesion, surface finish, and plating uniformity.
Mechanical Property Optimization
Reviewing material hardness, tensile strength, elongation, and dimensional stability according to application requirements.
Electrical Contact Performance
Considering surface condition, coating characteristics, and factors that may influence contact resistance and electrical reliability.
New Material Development
Supporting customer-specific technical projects through feasibility evaluations, sample development, and material optimization.
Your Design. Our Expertise. Your Customized Material.
Every semiconductor testing application has different technical requirements.
At Sichuan Winner, we aim to understand your application before recommending a suitable material solution.
Our customization options include:
Custom Wire Diameter: Precision wire dimensions according to technical requirements.
Custom Material Composition: Tungsten, molybdenum, tungsten-rhenium, and other materials subject to feasibility.
Custom Gold-Plating Thickness: Coating specifications tailored to application needs.
Custom Mechanical Properties: Strength, hardness, elongation, and flexibility requirements.
Custom Surface Finish: Surface quality and coating uniformity specifications.
Custom Wire Length: Flexible spool lengths based on customer needs.
Custom Packaging: Packaging configurations designed for material protection and handling.
Special R&D Projects: Collaborative development of non-standard precision metal wire materials.
All customized specifications are subject to technical evaluation and confirmation.
Our precision metal wire materials can be evaluated for:
Semiconductor Test Probes
Probe Card Manufacturing
Wafer-Level Testing
IC Testing Components
Precision Electrical Contacts
Microelectronic Devices
Electronic Testing Instruments
Customized Probe Manufacturing
Final material suitability should be verified through customer-specific testing and qualification.
Precision Manufacturing. Technical Innovation. Personalized Solutions.
At Sichuan Winner Special Electronic Materials Co., Ltd., we focus on providing specialty electronic materials and customized precision metal wire solutions.
We emphasize:
✔ Precision Metal Wire Manufacturing
✔ Gold-Plating & Surface Treatment Technology
✔ Research & Development Support
✔ Personalized Technical Customization
✔ Material Quality & Consistency
✔ Professional Technical Communication
✔ Long-Term Customer Partnerships
Our goal is to support customers in developing reliable, high-performance electronic testing components.
Are you developing a new semiconductor test probe?
Looking for a customized gold-plated tungsten or molybdenum wire?
Need a special wire diameter, gold-plating thickness, or mechanical property?
Tell us your requirements. Let's explore the possibilities together.
For technical evaluation and quotation, please provide:
Required material
Wire diameter and tolerance
Gold-plating thickness
Mechanical property requirements
Intended application
Estimated order quantity
Special packaging requirements
Sichuan Winner Special Electronic Materials Co., Ltd.
Website: www.winner-sc.com
Contact us for customized specifications, technical discussions, sample inquiries, and quotations.
Not Just a Wire. A Solution Engineered for You.
Precision in Every Micron. Reliability in Every Contact.
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