1.0mil Palladium-Coated Copper Bonding Wire (PCC Wire) | Precision Semiconductor Packaging Solutions – Sichuan Winner

Precision Bonding. Reliable Connections. Customized Innovation.

Product Overview

At Sichuan Winner Special Electronic Materials Co., Ltd., we believe that every reliable semiconductor connection begins with precision materials.

Our 1.0mil (25.4μm) Palladium-Coated Copper Bonding Wire, commonly known as PCC Wire, is designed for semiconductor packaging and microelectronic interconnection applications.

PCC bonding wire combines the excellent electrical and thermal conductivity of a copper core with the protective properties of a thin palladium coating.

Compared with uncoated copper bonding wire, the palladium coating helps improve oxidation resistance and supports more consistent bonding performance under appropriately controlled process conditions.

With a nominal diameter of 1.0mil, this wire is suitable for semiconductor packaging applications requiring precise wire dimensions, controlled bonding characteristics, and reliable electrical interconnections.

We don't just supply bonding wire. We work with customers to develop material solutions tailored to their packaging requirements.

Key Product Features & Advantages

1. High Electrical Conductivity

The copper core provides excellent electrical conductivity, supporting efficient signal and power transmission in semiconductor devices.

2. Palladium-Coated Surface Protection

The palladium coating helps reduce surface oxidation and improves the handling and storage characteristics of copper bonding wire.

3. Precision Diameter – 1.0mil (25.4μm)

Fine wire dimensions support miniature semiconductor interconnections and high-density packaging applications.

4. Reliable Bonding Performance

PCC wire is widely used in semiconductor packaging because of its potential for stable ball bonding and stitch bonding when compatible equipment and optimized process parameters are used.

5. Mechanical Strength & Stability

The copper core offers good mechanical strength, supporting wire-loop formation and maintaining structural stability during suitable bonding processes.

6. Application-Oriented Customization

Material characteristics and packaging configurations can be evaluated according to specific customer requirements.

Product Specifications

R&D Capabilities – Innovation in Every Connection

Your Packaging Challenges Inspire Our Innovation.

At Sichuan Winner, we understand that semiconductor packaging technologies continue to evolve toward higher integration, smaller dimensions, and more demanding reliability requirements.

Our R&D-oriented approach focuses on material evaluation, surface coating technology, process optimization, and customer-specific bonding wire solutions.

Palladium Coating Technology

Evaluating palladium coating uniformity, thickness, surface condition, and oxidation resistance to address different bonding requirements.

Copper Core Material Optimization

Reviewing copper purity, mechanical characteristics, and material consistency for semiconductor interconnection applications.

Bonding Performance Evaluation

Working with customers to assess material compatibility with ball bonding, stitch bonding, and wire-loop formation requirements.

Mechanical Property Development

Exploring tensile strength, elongation, and wire-handling characteristics according to different packaging processes.

New Product Development

Supporting non-standard specifications through technical discussions, feasibility evaluations, and sample development.

Personalized Customization – Engineered for Your Packaging Process

Your Application. Your Requirements. Our Precision Solution.

At Sichuan Winner, we understand that different semiconductor packaging processes require different bonding wire characteristics.

Our customization options may include:

• Custom Wire Diameter: Precision bonding wire dimensions according to application requirements.

• Custom Palladium Coating: Coating thickness and surface characteristics based on technical feasibility.

• Custom Mechanical Properties: Tensile strength and elongation requirements.

• Custom Surface Quality: Surface cleanliness and coating uniformity specifications.

• Custom Spool Configuration: Spool type, wire length, and packaging arrangements.

• Application-Specific Development: Technical evaluation for different semiconductor packaging processes.

• Special R&D Projects: Collaborative development of non-standard bonding wire specifications.

All customized solutions are subject to technical review, sample evaluation, and manufacturing feasibility.

Potential Applications

Our 1.0mil PCC bonding wire can be evaluated for:

• Semiconductor IC Packaging

• Integrated Circuit Wire Bonding

• Discrete Semiconductor Devices

• Power Semiconductor Packaging

• LED Packaging

• Microelectronic Interconnections

• Electronic Component Packaging

• Customized Semiconductor Assembly Processes

Final suitability depends on device design, bonding equipment, process conditions, and customer qualification testing.

Why Choose Sichuan Winner?

Precision Materials. Technical Innovation. Personalized Solutions.

Sichuan Winner Special Electronic Materials Co., Ltd. focuses on specialty electronic materials and precision bonding wire solutions.

Our customer-oriented approach emphasizes:

✔ Precision Bonding Wire Materials

✔ Palladium Surface Coating Technology

✔ Research & Development Support

✔ Customized Technical Specifications

✔ Material Quality & Consistency

✔ Professional Technical Communication

✔ Long-Term Customer Partnerships

We believe that successful semiconductor packaging begins with reliable materials and close technical collaboration.

Let's Develop Your Next Bonding Wire Solution

Are you looking for 1.0mil PCC bonding wire?

Do you require specific tensile strength, elongation, or palladium coating characteristics?

Are you developing a new semiconductor packaging process?

Share your requirements with us. Let's explore the right material solution together.

For technical evaluation and quotation, please provide:

• Required wire diameter

• Palladium coating requirements

• Tensile strength and elongation specifications

• Bonding equipment and process

• Spool type and required length

• Estimated order quantity

• Intended semiconductor application

Contact Sichuan Winner

Sichuan Winner Special Electronic Materials Co., Ltd.

Website: www.winner-sc.com

Contact us for customized specifications, technical discussions, sample inquiries, and quotations.

Not Just a Bonding Wire. A Connection Engineered for Reliability.

Precision in Every Micron. Reliability in Every Bond.

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