0.8mil Palladium-Coated Copper Bonding Wire (PCC Wire) | Precision Semiconductor Packaging Solutions – Sichuan Winner

Precision in Every Micron. Reliability in Every Bond.

Product Overview

At Sichuan Winner Special Electronic Materials Co., Ltd., we believe that even the smallest wire can play a critical role in the performance and reliability of advanced semiconductor devices.
Our 0.8mil (20.32μm) Palladium-Coated Copper Bonding Wire, also known as PCC Wire, is a precision bonding material designed for semiconductor packaging and microelectronic interconnections.
By combining the excellent electrical and thermal conductivity of a copper core with the oxidation-resistant properties of a thin palladium coating, PCC wire offers a practical solution for modern semiconductor wire bonding applications.
With its ultra-fine diameter, 0.8mil PCC bonding wire can be evaluated for fine-pitch packaging applications requiring precise wire dimensions, controlled loop formation, and reliable electrical connections.
We don't just supply bonding wire. We work with customers to develop precision interconnection solutions tailored to their applications.

Key Product Features & Advantages

1. Ultra-Fine Diameter – 0.8mil (20.32μm)

The fine wire diameter supports miniature semiconductor interconnections and applications requiring compact packaging designs.

2. High Electrical Conductivity

The copper core provides excellent electrical and thermal conductivity, supporting efficient electrical interconnections in semiconductor devices.

3. Palladium-Coated Surface Protection

The thin palladium coating helps reduce copper surface oxidation and supports consistent wire handling and bonding performance under suitable process conditions.

4. Reliable Bonding Performance

PCC wire is suitable for evaluation in thermosonic ball bonding and stitch bonding processes.
With optimized bonding parameters, it can support stable free-air ball formation, wire looping, and bond formation.

5. Mechanical Strength & Dimensional Stability

Copper provides useful mechanical strength, while controlled wire properties can support stable loop formation and wire handling during semiconductor assembly.

6. Application-Specific Customization

Wire diameter, mechanical properties, coating specifications, and packaging configurations can be evaluated according to customer requirements.

Product Specifications

R&D Capabilities – Innovation in Every Connection

Your Packaging Challenges Inspire Our Innovation.
At Sichuan Winner, we understand that semiconductor packaging technology is evolving toward smaller dimensions, higher interconnection density, and increasingly demanding reliability requirements.
Our R&D-oriented approach focuses on material selection, surface coating technology, mechanical property optimization, and customer-specific bonding wire development.

Palladium Coating Technology

Evaluating palladium coating thickness, surface uniformity, adhesion, and oxidation resistance to address different packaging requirements.

Copper Core Material Optimization

Reviewing copper purity, microstructure, mechanical characteristics, and material consistency for precision wire bonding.

Bonding Performance Evaluation

Supporting technical discussions related to free-air ball formation, ball bonding, stitch bonding, wire-loop stability, and process compatibility.

Mechanical Property Development

Exploring tensile strength, elongation, wire flexibility, and handling characteristics for different semiconductor packaging applications.

New Product Development

Collaborating with customers on non-standard bonding wire specifications through technical feasibility reviews and sample evaluation.

Personalized Customization – Engineered for Your Packaging Process

Your Design. Our Expertise. Your Customized Bonding Wire.
At Sichuan Winner, we recognize that every semiconductor packaging process has unique requirements.
Our goal is to help customers identify suitable bonding wire specifications based on their equipment, package design, and reliability expectations.
Our customization options include:

• Custom Wire Diameter: Precision bonding wire dimensions according to customer requirements.

• Custom Palladium Coating: Coating thickness and surface characteristics based on technical feasibility.

• Custom Mechanical Properties: Tensile strength and elongation requirements for different bonding processes.

• Custom Surface Quality: Surface cleanliness and coating uniformity specifications.

• Custom Spool Configuration: Spool type, wire length, and packaging arrangements.

• Application-Specific Optimization: Technical evaluation for different bonding machines and packaging designs.

• Special R&D Projects: Collaborative development of customized bonding wire materials.

All customized specifications are subject to technical review, manufacturing feasibility, and customer qualification.

Potential Applications

Our 0.8mil PCC bonding wire can be evaluated for:

• Semiconductor IC Packaging

• Fine-Pitch Wire Bonding

• Integrated Circuit Interconnections

• Discrete Semiconductor Devices

• LED Packaging

• Power Semiconductor Packaging

• Microelectronic Components

• Customized Semiconductor Assembly Processes

Final application suitability depends on device design, bonding equipment, process parameters, and qualification testing.

Why Choose Sichuan Winner?

Precision Materials. Technical Innovation. Personalized Solutions.
At Sichuan Winner Special Electronic Materials Co., Ltd., we focus on specialty electronic materials and precision bonding wire solutions.
Our customer-oriented approach emphasizes:

• Precision bonding wire materials

• Palladium surface coating technology

• Research and development support

• Personalized technical customization

• Material quality and consistency

• Professional technical communication

• Long-term customer partnerships

We believe that successful semiconductor packaging requires reliable materials, technical collaboration, and continuous improvement.

Let's Develop Your Next Bonding Wire Solution

Are you looking for 0.8mil PCC bonding wire for semiconductor packaging?
Do you need specific tensile strength, elongation, palladium coating characteristics, or spool configurations?
Are you developing a new fine-pitch semiconductor packaging process?
Share your requirements with us. Let's explore a suitable solution together.
For technical evaluation and quotation, please provide:

• Required wire diameter and tolerance

• Palladium coating requirements

• Tensile strength and elongation specifications

• Bonding equipment and process conditions

• Spool type and required length

• Estimated order quantity

• Intended semiconductor application

Contact Sichuan Winner

Sichuan Winner Special Electronic Materials Co., Ltd.
Website: www.winner-sc.com
Contact us for technical discussions, customized specifications, sample inquiries, and quotations.
Not Just a Bonding Wire. A Connection Engineered for Reliability.
Precision in Every Micron. Reliability in Every Bond.
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