0.9mil Palladium-Coated Copper Bonding Wire (PCC Wire) | Custom Semiconductor Packaging Solutions – Sichuan Winner

Precision in Every Micron. Reliability in Every Bond.

Product Overview

At Sichuan Winner Special Electronic Materials Co., Ltd., we believe that every reliable semiconductor connection starts with precision materials.
Our 0.9mil (22.86μm) Palladium-Coated Copper Bonding Wire, commonly known as PCC Wire, is a precision bonding material developed for semiconductor packaging and microelectronic interconnection applications.
By combining the excellent electrical and thermal conductivity of a copper core with the oxidation-resistant properties of a thin palladium coating, PCC bonding wire offers an effective material solution for modern semiconductor assembly processes.
With a nominal diameter of 0.9mil, this wire can be evaluated for semiconductor packaging applications requiring fine wire dimensions, controlled loop formation, and reliable electrical connections.
We don't just supply bonding wire. We help develop customized interconnection solutions tailored to your packaging requirements.

Key Product Features & Advantages

1. Precision Diameter – 0.9mil (22.86μm)

The fine wire diameter supports miniature electronic interconnections and semiconductor packaging designs requiring precise dimensional control.

2. High Electrical Conductivity

The copper core provides excellent electrical and thermal conductivity, supporting efficient electrical connections and heat transfer.

3. Palladium-Coated Surface Protection

The thin palladium coating helps reduce copper surface oxidation and supports improved surface stability during handling and storage.

4. Reliable Bonding Performance

PCC bonding wire is suitable for evaluation in thermosonic ball bonding and stitch bonding applications.
With appropriate bonding equipment and optimized process parameters, it can support consistent free-air ball formation, controlled wire looping, and reliable bond formation.

5. Mechanical Strength & Stability

Copper offers useful mechanical strength, while controlled wire properties can support stable loop formation and handling during semiconductor packaging.

6. Application-Oriented Customization

Wire dimensions, coating specifications, mechanical characteristics, and packaging configurations can be evaluated according to specific customer requirements.

Product Specifications

R&D Capabilities – Innovation in Every Connection

Your Packaging Challenges Inspire Our Innovation.
At Sichuan Winner, we recognize that semiconductor packaging technologies continue to evolve toward smaller dimensions, higher interconnection density, and more demanding reliability requirements.
Our R&D-oriented approach focuses on material selection, surface coating technology, mechanical property evaluation, and customer-specific product development.

Palladium Coating Technology

Evaluating palladium coating thickness, uniformity, adhesion, and surface characteristics to address different semiconductor bonding requirements.

Copper Core Material Optimization

Reviewing copper purity, mechanical properties, microstructure, and material consistency for precision wire bonding applications.

Bonding Performance Evaluation

Supporting technical discussions related to free-air ball formation, ball bonding, stitch bonding, wire-loop stability, and bonding process compatibility.

Mechanical Property Development

Exploring tensile strength, elongation, flexibility, and wire-handling characteristics for different semiconductor packaging requirements.

New Product Development

Collaborating with customers on non-standard bonding wire specifications through technical feasibility reviews, sample evaluation, and application-oriented development.

Personalized Customization – Engineered for Your Application

Your Design. Our Expertise. Your Customized Bonding Wire.
At Sichuan Winner, we understand that every semiconductor packaging process has different technical requirements.
Rather than offering only standard specifications, we aim to work closely with customers to evaluate suitable bonding wire solutions based on their equipment, package design, and performance expectations.
Our customization options include:

• Custom Wire Diameter: Precision bonding wire dimensions according to customer requirements.

• Custom Palladium Coating: Coating thickness and surface characteristics subject to technical feasibility.

• Custom Mechanical Properties: Tensile strength, elongation, and flexibility requirements.

• Custom Surface Quality: Surface cleanliness and coating uniformity specifications.

• Custom Spool Configuration: Spool type, wire length, and packaging arrangements.

• Application-Specific Optimization: Technical evaluation for different bonding machines and semiconductor packaging designs.

• Special R&D Projects: Collaborative development of customized bonding wire materials.

All customized specifications are subject to technical review, manufacturing feasibility, and customer qualification.

Potential Applications

Our 0.9mil PCC bonding wire can be evaluated for:

• Semiconductor IC Packaging

• Fine-Pitch Wire Bonding

• Integrated Circuit Interconnections

• Discrete Semiconductor Devices

• LED Packaging

• Power Semiconductor Packaging

• Microelectronic Components

• Customized Semiconductor Assembly Processes

Final application suitability depends on device design, bonding equipment, process parameters, and qualification testing.

Why Choose Sichuan Winner?

Precision Materials. Technical Innovation. Personalized Solutions.
At Sichuan Winner Special Electronic Materials Co., Ltd., we focus on specialty electronic materials and precision bonding wire solutions.
Our customer-oriented approach emphasizes:

• Precision bonding wire materials

• Palladium surface coating technology

• Research and development support

• Personalized technical customization

• Material quality and consistency

• Professional technical communication

• Long-term customer partnerships

We believe that successful semiconductor packaging requires reliable materials, technical collaboration, and continuous improvement.

Let's Develop Your Next Bonding Wire Solution

Are you looking for 0.9mil PCC bonding wire for semiconductor packaging?
Do you need specific tensile strength, elongation, palladium coating characteristics, or spool configurations?
Are you developing a new semiconductor packaging process?
Share your technical requirements with us. Let's explore a suitable solution together.
For technical evaluation and quotation, please provide:

• Required wire diameter and tolerance

• Palladium coating requirements

• Tensile strength and elongation specifications

• Bonding equipment and process conditions

• Spool type and required length

• Estimated order quantity

• Intended semiconductor application

Contact Sichuan Winner

Sichuan Winner Special Electronic Materials Co., Ltd.
Website: www.winner-sc.com
Contact us for technical discussions, customized specifications, sample inquiries, and quotations.
Not Just a Bonding Wire. A Connection Engineered for Reliability.
Precision in Every Micron. Reliability in Every Bond.
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