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electrical beryllium wire
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Bonding Wire

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Gold Plated Tungsten Wire

(43)

Gold Plated Copper Wire

(21)

Gold Plated Molybdenum Wire

(21)

Tungsten Wire

(17)

Gold Plated Silver Wire

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Palladium Coated Copper Wire

(26)

Ultra Fine Copper Wire

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Beryllium Copper Wire

(18)

Spring Test Probes

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Gold Electroplating Service

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electrical beryllium wire (38)  Online Manufacturer

Good price Industrial Grade Beryllium Copper Wire 0.01mm-0.4mm In Metalworking And Joining Processes online Video

Industrial Grade Beryllium Copper Wire 0.01mm-0.4mm In Metalworking And Joining Processes

Tensile Strength: ≥980MPa

Coating Material: Ultra-fine Coating

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Good price Customizable and High-Performance Beryllium Copper Wire for Precision Electronics Manufacturing online Video

Customizable and High-Performance Beryllium Copper Wire for Precision Electronics Manufacturing

Material: Beryllium Copper

Machining Property: Good

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Good price High-Quality Ultra Fine Wire 0.01mm Diameter Beryllium Copper Wire For Precision Electronics Manufacturing online Video

High-Quality Ultra Fine Wire 0.01mm Diameter Beryllium Copper Wire For Precision Electronics Manufacturing

Product Type: Bonding Wire

Wire Diameter: 0.001 Inches

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Good price Beryllium Copper Wire for Electrical Contacts and Springs online

Beryllium Copper Wire for Electrical Contacts and Springs

Diameter: 0.01mm - 0.4mm

Availability: Custom Sizes Available

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Good price 99.99% Pure BeCu Bonding Wire 0.01-0.4mm for Semiconductor Packaging online

99.99% Pure BeCu Bonding Wire 0.01-0.4mm for Semiconductor Packaging

Purity: 99.99%

Bonding Method: Ultrasonic, Thermocompression, Laser

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Good price Beryllium Copper Wire 0.01-0.4MM for Ultrasonic Bonding online

Beryllium Copper Wire 0.01-0.4MM for Ultrasonic Bonding

Application: Wire Bonding

Bond Strength: High

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Good price 20um Gold Bonding Wire for High Electrical Performance and Low Loop in Semiconductor Packaging online Video

20um Gold Bonding Wire for High Electrical Performance and Low Loop in Semiconductor Packaging

Application: Semiconductor Packaging, Microelectronics, Medical Devices

Package: Spool

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Good price Ultra Fine Gold Bonding Wire, Dia. 13-70μm, 99.99% Purity online Video

Ultra Fine Gold Bonding Wire, Dia. 13-70μm, 99.99% Purity

Application: Semiconductor Packaging, Microelectronics, Medical Devices

Package: Spool

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Good price 0.7mil Ultra Fine Copper Wire With Electrical And Thermal Conductivity Polished Surface online Video

0.7mil Ultra Fine Copper Wire With Electrical And Thermal Conductivity Polished Surface

Diameter: 18(0.7mil)

Breaking Load BL(gf): >4

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Good price Ultra Fine Gold Bonding Wire with 0.0125mm and 0.05mm Diameter for Scientific Research online Video

Ultra Fine Gold Bonding Wire with 0.0125mm and 0.05mm Diameter for Scientific Research

Application: Semiconductor Packaging, Microelectronics, Medical Devices

Package: Spool

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Good price 9999 Pure 0.03mm Round Gold Wire 30um Metal Au Bonding Wire online Video

9999 Pure 0.03mm Round Gold Wire 30um Metal Au Bonding Wire

Application: Semiconductor Packaging, Microelectronics, Medical Devices

Package: Spool

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Good price Aerospace Industry Ultra Fine Copper Wire Corrosion Resistance online Video

Aerospace Industry Ultra Fine Copper Wire Corrosion Resistance

Breaking Load BL(gf): >4

Elongation EL(%): 3-20

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Good price High Corrosion Resistance Gold Bonding Wire with Ultrasonic Bonding Method and Bright Surface Finish online Video

High Corrosion Resistance Gold Bonding Wire with Ultrasonic Bonding Method and Bright Surface Finish

Application: Semiconductor Packaging, Microelectronics, Medical Devices

Package: Spool

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Good price Fine 9999% Au gold wire/thread on a spool online Video

Fine 9999% Au gold wire/thread on a spool

Application: Semiconductor Packaging, Microelectronics, Medical Devices

Package: Spool

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Good price Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs online Video

Good Arc Share Au Gold and Ag Alloy Bonding Wire for Packaging TR ICs

Application: Semiconductor Packaging, Microelectronics, Medical Devices

Package: Spool

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Good price 0.025mm Diameter Gold Bonding Wire for Semiconductor Packaging and Microelectronics Applications online Video

0.025mm Diameter Gold Bonding Wire for Semiconductor Packaging and Microelectronics Applications

Application: Semiconductor Packaging, Microelectronics, Medical Devices

Package: Spool

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