electrical beryllium wire (43) Online Manufacturer
Material: Beryllium Copper
Machining Property: Good
Material: Beryllium Copper
Machining Property: Good
Product Type: Bonding Wire
Wire Diameter: 0.001 Inches
Tensile Strength: ≥980MPa
Coating Material: Ultra-fine Coating
Application: Wire Bonding
Package: Spool
Application: Wire Bonding
Package: Spool
Application: Wire Bonding
Package: Spool
Purity: 99.99%
Bonding Method: Ultrasonic, Thermocompression, Laser
Diameter: 0.01mm - 0.4mm
Availability: Custom Sizes Available
Application: Wire Bonding
Bond Strength: High
Application: Wire Bonding
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Diameter: 18(0.7mil)
Breaking Load BL(gf): >4
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
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