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Home > products > Bonding Wire >
High tensile test performance Ultra Fine Wire Gold Bonding Wire for semiconductor packaging and assembly processes

High tensile test performance Ultra Fine Wire Gold Bonding Wire for semiconductor packaging and assembly processes

Semiconductor Packaging Bonding Wire

Ultra Fine Wire Bonding Wire

High Tensile Test Performance Bonding Wire

Place of Origin:

China

Brand Name:

WINNER

Certification:

ISO 9001, ISO 14001, RoHS

Model Number:

WGBW-1

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Request A Quote
High tensile test performance Ultra Fine Wire Gold Bonding Wire for semiconductor packaging and assembly processes
High tensile test performance Ultra Fine Wire Gold Bonding Wire for semiconductor packaging and assembly processes High tensile test performance Ultra Fine Wire Gold Bonding Wire for semiconductor packaging and assembly processes High tensile test performance Ultra Fine Wire Gold Bonding Wire for semiconductor packaging and assembly processes
Product Details
Density:
19.34 G/cm3
Purity:
99.99%
Material:
Gold
Tensile Strength:
100 - 500 MPa
Bonding Method:
Ultrasonic, Thermocompression, Laser
Package:
Spool, Reel, Coil
Highlight:

Semiconductor Packaging Bonding Wire

,

Ultra Fine Wire Bonding Wire

,

High Tensile Test Performance Bonding Wire

Payment & Shipping Terms
Minimum Order Quantity
1pc
Price
1~999
Packaging Details
Roll, Neutrial Packing or with OEM LOGO
Delivery Time
5~8 working days.
Payment Terms
T/T, Western Union, L/C
Supply Ability
1000000 rolls per month
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Contact Us
86-15818576616
sales@winner-sc.com
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Product Description

High tensile test performance Ultra Fine Wire Gold Bonding Wire for semiconductor packaging and assembly processes

Ultra-fine gold bonding wire (15-50μm diameter) delivers exceptional tensile strength (≥12g) for critical semiconductor interconnects in advanced IC packaging. Engineered with 99.99% pure gold, it ensures superior electrical conductivity (≤2.0μΩ·cm) and oxidation resistance, minimizing wire breakage risks in high-frequency/high-temperature environments. Ideal for automotive electronics, medical devices, and aerospace applications requiring MIL-STD-883 compliance.

Key advantages:
  • Precision Control: ±0.5μm diameter tolerance for stable loop formation
  • Cost Efficiency: 30% lower breakage rate vs. copper alternatives
  • Eco-Compliance: RoHS-certified, halogen-free
  • Optimized for wire bonding machines (K&S, ASM), our wire enhances production yields by 15% while meeting JEDEC J-STD-035 standards. Custom spool lengths (500-2000m) with ESD-safe packaging available.
 
 
Winner manufacture gold wire in diameters as small as 0.0005 inch (12.5 microns), with highly uniform elongation, tensile strength, and dimensional properties. All our high-purity gold wire products, including bonding wires and gold wires, are produced from highly refined, vacuum-processed metals.
 
 

Physical Properties

Density:
19.34 g/cm3
Melting Point:
1063°C
Electrical Resistivity: (@20°C)
2.3 μΩ-cm
Electrical Conductivity: (@20°C)
75% (IACS)
Thermal Conductivity: (@20°C)
315 W/(m-K)
Fusing Current (10 mm x 25 μm)
0.52 A
 
We take pride in offering a complete range of wire diameters, thereby fulfilling the diverse needs for strength and elongation in different wire applications. Moreover, we collaborate closely with our customers to provide customized solutions. In these custom solutions, technical parameters such as tensile strength and elongation are meticulously tailored to meet their specific requirements. This customer-centric approach enables us to not only meet but exceed the expectations of our clients in the highly competitive market of wire manufacturing and bonding applications.
 
Composition
Diameter
Tensile Strength (gms)
Elongation (%)
99.99% Au
0.7 mil
17.5 μm
3 - 10
2 - 6
0.8 mil
20 μm
4 - 13
2 - 7
0.9 mil
22.5 μm
5 - 16
2 - 8
1.0 mil
25 μm
6 - 20
2 - 8
1.3 mil
32.5 μm
10 - 45
2 - 10
1.5 mil
37.5 μm
13 - 50
2 - 12
1.7 mil
42.5 μm
15 - 60
2 - 12
1.8 mil
45 μm
20 - 70
2 - 12
2.0 mil
50 μm
25 - 85
2 - 15
3.0 mil
75 μm
50 - 180
2 - 20
 
Why Gold Bonding Wire?
Gold (Au) bonding wire is used in a wide range of applications rangining from high pin-count, ultra-fine pitch microelectronic devices to high-power discrete components. Au is the preferred choice of bonding material when a) the contact material is not compatible with Aluminum (Al) and/or Copper (Cu) b) the contact area is limited c) the device will be subject to high temperature or high humidity environments.
 
The Advantages of Gold Bonding Wire:
• Extreme bond reliability
• A wide processing window
• Low-impact ball and wedge bonding
• Superior looping performance
• High tensile test performance
• Excellent corrosion resistance
• Higher fusing current than standard Al bond wire.
 

 

Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 0

1.What kind of Enameled copper wire do Winner produce?

We focus on research and development of selfbonding magnet round copper wire, fine polyurethane magnet wire, selfbonding litz copper wire and selfbonding silk covered wire.

 

2.What's diameters available of the Enamelled copper wire ?

We specialize in fine and ultra fine enamelled copper wire,diameters available of our products is Φ0.018-0.50mm.

 

3.What's selfbonding enameled copper wire?

Selfbonding enamelled copper wire is a special type of enamelled wire with an additional adhesive enamel overcoat such as thermoplastic resin.This adhesive has a bonding feature, which is activated

by heat or solvents.

Once activated the adhesive bonds turn to turn windings into a compact self supporting coil.

The use of selfbonding wire may offer cost and manufacturing advantages in some winding applications

as bobbins, tape, varnishing, or impregnation may be eliminated.

 

4. Is possible to get any sample of selfbonding enamelled copper wire that you have in production?

Of course you can!

Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 1

Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 2

Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 3

 

Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 5

Tags：

Aluminum Bonding Wire

wire bond wire

aluminium bonding wire

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Email：sales@winner-sc.com
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