Ultra Fine Wire 0.01mm diameter Gold Bonding Wire for Semiconductor Packaging
Optimized for high-density semiconductor packaging, this ultra-fine 0.01mm gold bonding wire delivers exceptional electrical conductivity (≤2.4 μΩ·cm) and mechanical reliability in advanced IC manufacturing. Crafted from 99.999% high-purity gold with trace alloy elements, it ensures stable performance across extreme temperatures (-55°C to 300°C) and minimizes signal loss in microelectronics, MEMS devices, and 5G modules.
Featuring a tensile strength of ≥4,200 MPa and ultra-smooth surface finish, this wire reduces breakage risks during high-speed thermosonic bonding, achieving precise ball diameters (2.5–3.5φ) and loop heights for sub-micron interconnects. Its superior fatigue resistance withstands 10,000+ bonding cycles, making it ideal for automotive electronics, medical sensors, and AI chip packaging.
ROHS-compliant and compatible with automated wire bonders, it replaces costlier palladium-coated alternatives while enhancing production yields by 15–20%. Trusted by global semiconductor leaders, this gold bonding wire sets the standard for miniaturization, durability, and energy efficiency in next-gen electronics.
Gold (Au) bonding wire is one of the most commonly used types of wire in the semiconductor industry for creating wire bonds between a semiconductor die and its package. It is known for its excellent electrical conductivity, good thermal conductivity, and high reliability.
Gold bonding wire is typically made from high-purity gold, which has a purity level of 99.99% or higher. The wire is usually supplied in spools and is available in various diameters, ranging from 10 to 40 microns.
Winner offers a wide selection of ball, wedge and stud bonding wires in a varied portfolio of 4N 99.99 / 3N 99.9 / 2N 99.0.
* Raw materials of high purity (99,999 %)
* Stable mechancial qualities
* Wire surface of high quality
* Made according to customer specifications
* With a diameter down to a size of 0.6 mils / 15 microns for very fine applications.
* For ball or wedge bonding or stud bumping
The gold bonding wire is a kind of material for semiconductor packaging which has excellent electrical conductivity, thermal conductivity, mechanical properties, and chemical stability. This product is used as an inner lead for packaging and is one of the essential materials in the manufacturing process of integrated circuits and semiconductor separators. Winner can provide Au bonding wire with different wire diameters from 10um-40um according to customer requirements.
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Density:
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19.34 g/cm3
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Melting Point:
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1063°C
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Electrical Resistivity: (@20°C)
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2.3 μΩ-cm
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Electrical Conductivity: (@20°C)
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75% (IACS)
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Thermal Conductivity: (@20°C)
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315 W/(m-K)
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Fusing Current (10 mm x 25 μm)
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0.52 A
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We take pride in offering a complete range of wire diameters, thereby fulfilling the diverse needs for strength and elongation in different wire applications. Moreover, we collaborate closely with our customers to provide customized solutions. In these custom solutions, technical parameters such as tensile strength and elongation are meticulously tailored to meet their specific requirements. This customer-centric approach enables us to not only meet but exceed the expectations of our clients in the highly competitive market of wire manufacturing and bonding applications.
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Composition
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Diameter
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Tensile Strength (gms)
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Elongation (%)
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99.99% Au
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0.7 mil
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17.5 μm
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3 - 10
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2 - 6
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0.8 mil
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20 μm
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4 - 13
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2 - 7
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0.9 mil
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22.5 μm
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5 - 16
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2 - 8
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1.0 mil
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25 μm
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6 - 20
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2 - 8
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1.3 mil
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32.5 μm
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10 - 45
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2 - 10
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1.5 mil
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37.5 μm
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13 - 50
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2 - 12
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1.7 mil
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42.5 μm
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15 - 60
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2 - 12
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1.8 mil
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45 μm
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20 - 70
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2 - 12
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2.0 mil
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50 μm
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25 - 85
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2 - 15
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3.0 mil
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75 μm
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50 - 180
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2 - 20
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Why Gold Bonding Wire?
Gold (Au) bonding wire is used in a wide range of applications rangining from high pin-count, ultra-fine pitch microelectronic devices to high-power discrete components. Au is the preferred choice of bonding material when a) the contact material is not compatible with Aluminum (Al) and/or Copper (Cu) b) the contact area is limited c) the device will be subject to high temperature or high humidity environments.
The Advantages of Gold Bonding Wire:
• Extreme bond reliability
• A wide processing window
• Low-impact ball and wedge bonding
• Superior looping performance
• High tensile test performance
• Excellent corrosion resistance
• Higher fusing current than standard Al bond wire.
1.What kind of Enameled copper wire do Winner produce?
We focus on research and development of selfbonding magnet round copper wire, fine polyurethane magnet wire, selfbonding litz copper wire and selfbonding silk covered wire.
2.What's diameters available of the Enamelled copper wire ?
We specialize in fine and ultra fine enamelled copper wire,diameters available of our products is Φ0.018-0.50mm.
3.What's selfbonding enameled copper wire?
Selfbonding enamelled copper wire is a special type of enamelled wire with an additional adhesive enamel overcoat such as thermoplastic resin.This adhesive has a bonding feature, which is activated
by heat or solvents.
Once activated the adhesive bonds turn to turn windings into a compact self supporting coil.
The use of selfbonding wire may offer cost and manufacturing advantages in some winding applications
as bobbins, tape, varnishing, or impregnation may be eliminated.
4. Is possible to get any sample of selfbonding enamelled copper wire that you have in production?
Of course you can!
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