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Home > products > Bonding Wire >
0.01mm Diameter Ultra Fine Gold Bonding Wire Meeting the Demands of Ultra-Fine Electronic Bonding

0.01mm Diameter Ultra Fine Gold Bonding Wire Meeting the Demands of Ultra-Fine Electronic Bonding

Ultra Fine Gold Bonding Wire

Electronic Bonding Gold Bonding Wire

0.01mm Diameter Gold Bonding Wire

Place of Origin:

China

Brand Name:

WINNER

Certification:

ISO 9001, ISO 14001, RoHS

Model Number:

WGBW-2

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Request A Quote
0.01mm Diameter Ultra Fine Gold Bonding Wire Meeting the Demands of Ultra-Fine Electronic Bonding
0.01mm Diameter Ultra Fine Gold Bonding Wire Meeting the Demands of Ultra-Fine Electronic Bonding 0.01mm Diameter Ultra Fine Gold Bonding Wire Meeting the Demands of Ultra-Fine Electronic Bonding 0.01mm Diameter Ultra Fine Gold Bonding Wire Meeting the Demands of Ultra-Fine Electronic Bonding 0.01mm Diameter Ultra Fine Gold Bonding Wire Meeting the Demands of Ultra-Fine Electronic Bonding
Product Details
Density:
19.34 G/cm3
Purity:
99.99%
Material:
Gold
Tensile Strength:
100 - 500 MPa
Bonding Method:
Ultrasonic, Thermocompression, Laser
Temperature Range:
-40°C To 200°C
Package:
Spool, Reel, Coil
Melting Point:
1063°C
Highlight:

Ultra Fine Gold Bonding Wire

,

Electronic Bonding Gold Bonding Wire

,

0.01mm Diameter Gold Bonding Wire

Payment & Shipping Terms
Minimum Order Quantity
1pc
Price
1~999
Packaging Details
Roll, Neutrial Packing or with OEM LOGO
Delivery Time
5~8 working days.
Payment Terms
T/T, Western Union, L/C
Supply Ability
1000000 rolls per month
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Product Description

0.01mm Diameter Ultra Fine Gold Bonding Wire Meeting the Demands of Ultra-Fine Electronic Bonding

Designed for cutting-edge semiconductor packaging, this 0.01mm ultra-fine gold bonding wire meets the stringent demands of high-density microelectronics and advanced ICs. Crafted from 99.999% high-purity gold with trace elements to optimize hardness and conductivity, it ensures superior electrical performance and mechanical reliability in wire bonding applications
Ideal for gold ball bonding processes, its ultra-thin diameter enables precise interconnects in miniaturized devices like MEMS sensors, automotive ICs, and 5G modules. The wire’s exceptional tensile strength (≥4,000 MPa) and thermal stability (-55°C to 300°C) minimize breakage during high-speed bonding, while its low electrical resistance enhances signal integrity.
Using thermosonic bonding technology, it achieves robust first and second bonds with minimal cratering, adhering to strict quality standards for ball diameter (2.5φ–3.5φ), loop height, and bond placement
ROHS-compliant and compatible with automated bonding systems, this wire reduces production downtime and replaces costlier alternatives like palladium-coated copper in critical applications
Gold bonding wire offers several advantages over other types of wire. Winner can control the diameter of gold bonding wires depending on the customers’ requests. Winner is a leading supplier of metallic bonding wires
Winner offers a wide selection of ball, wedge and stud bonding wires in a varied portfolio of 5N 99.999  / 4N 99.99 / 3N 99.9 / 2N 99.0.
* Raw materials of high purity (99,999 %)
* Stable mechancial qualities
* Wire surface of high quality
* Made according to customer specifications
* With a diameter down to a size of 0.6 mils / 15 microns for very fine applications.
* For ball or wedge bonding or stud bumping
 
The gold bonding wire is a kind of material for semiconductor packaging which has excellent electrical conductivity, thermal conductivity, mechanical properties, and chemical stability. This product is used as an inner lead for packaging and is one of the essential materials in the manufacturing process of integrated circuits and semiconductor separators. Winner can provide Au bonding wire with different wire diameters from 10um-40um according to customer requirements.
 
 

Physical Properties

Density:
19.34 g/cm3
Melting Point:
1063°C
Electrical Resistivity: (@20°C)
2.3 μΩ-cm
Electrical Conductivity: (@20°C)
75% (IACS)
Thermal Conductivity: (@20°C)
315 W/(m-K)
Fusing Current (10 mm x 25 μm)
0.52 A
 
We take pride in offering a complete range of wire diameters, thereby fulfilling the diverse needs for strength and elongation in different wire applications. Moreover, we collaborate closely with our customers to provide customized solutions. In these custom solutions, technical parameters such as tensile strength and elongation are meticulously tailored to meet their specific requirements. This customer-centric approach enables us to not only meet but exceed the expectations of our clients in the highly competitive market of wire manufacturing and bonding applications.
 
Composition
Diameter
Tensile Strength (gms)
Elongation (%)
99.99% Au
0.7 mil
17.5 μm
3 - 10
2 - 6
0.8 mil
20 μm
4 - 13
2 - 7
0.9 mil
22.5 μm
5 - 16
2 - 8
1.0 mil
25 μm
6 - 20
2 - 8
1.3 mil
32.5 μm
10 - 45
2 - 10
1.5 mil
37.5 μm
13 - 50
2 - 12
1.7 mil
42.5 μm
15 - 60
2 - 12
1.8 mil
45 μm
20 - 70
2 - 12
2.0 mil
50 μm
25 - 85
2 - 15
3.0 mil
75 μm
50 - 180
2 - 20
 
Why Gold Bonding Wire?
Gold (Au) bonding wire is used in a wide range of applications rangining from high pin-count, ultra-fine pitch microelectronic devices to high-power discrete components. Au is the preferred choice of bonding material when a) the contact material is not compatible with Aluminum (Al) and/or Copper (Cu) b) the contact area is limited c) the device will be subject to high temperature or high humidity environments.
 
The Advantages of Gold Bonding Wire:
• Extreme bond reliability
• A wide processing window
• Low-impact ball and wedge bonding
• Superior looping performance
• High tensile test performance
• Excellent corrosion resistance
• Higher fusing current than standard Al bond wire.
 

 

Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 0

1.What kind of Enameled copper wire do Winner produce?

We focus on research and development of selfbonding magnet round copper wire, fine polyurethane magnet wire, selfbonding litz copper wire and selfbonding silk covered wire.

 

2.What's diameters available of the Enamelled copper wire ?

We specialize in fine and ultra fine enamelled copper wire,diameters available of our products is Φ0.018-0.50mm.

 

3.What's selfbonding enameled copper wire?

Selfbonding enamelled copper wire is a special type of enamelled wire with an additional adhesive enamel overcoat such as thermoplastic resin.This adhesive has a bonding feature, which is activated

by heat or solvents.

Once activated the adhesive bonds turn to turn windings into a compact self supporting coil.

The use of selfbonding wire may offer cost and manufacturing advantages in some winding applications

as bobbins, tape, varnishing, or impregnation may be eliminated.

 

4. Is possible to get any sample of selfbonding enamelled copper wire that you have in production?

Of course you can!

Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 1

Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 2

Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 3

Silver Bonding Wire with Composite Material Treatment for Performance in Servers and Systems 5

Tags：

Aluminum Bonding Wire

wire bond wire

aluminium bonding wire

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Email：sales@winner-sc.com
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