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Customizable Ultra Fine Gold Bonding Wire for Inner Lead Packaging in Integrated Circuits and Semiconductor Separators

Customizable Ultra Fine Gold Bonding Wire for Inner Lead Packaging in Integrated Circuits and Semiconductor Separators

ultra fine gold bonding wire

customizable semiconductor bonding wire

gold bonding wire for integrated circuits

Place of Origin:

CHINA

Brand Name:

WINNER

Certification:

ISO9100

Model Number:

WGBW-222

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Request A Quote
Product Details
Density:
19.34 G/cm3
Purity:
99.99%
Material:
Gold
Tensile Strength:
100 - 500 MPa
Bonding Method:
Ultrasonic, Thermocompression, Laser
Package:
Spool, Reel, Coil
Product Type:
Bonding Wire
Wire Diameter:
0.001 Inches
Coating Thickness:
0.001mm
Material:
Copper
Coating:
Gold
Length Meters:
500/1000
Corrosion Resistance:
High
Purity:
99.999%
Bonding Method:
Ultrasonic
Temperature Range:
-40°C To 200°C
Surface Finish:
Bright
Conductivity:
98%
Package Size:
100 Meters
Bond Strength:
High
Package:
Spool
Coating:
Noting
Highlight:

ultra fine gold bonding wire

,

customizable semiconductor bonding wire

,

gold bonding wire for integrated circuits

Payment & Shipping Terms
Minimum Order Quantity
1PC
Price
999
Packaging Details
Roll, Neutrial Packing or with OEM LOGO
Delivery Time
5-8 WORKING DAYS
Payment Terms
L/C, Western Union, T/T Supply Ability
Supply Ability
100000 rolls per month
Product Description

Customizable Ultra Fine Gold Bonding Wire for Precision IC & Semiconductor Packaging


Our ‌high-purity gold bonding wire‌ is specially engineered for ‌inner lead packaging‌ in advanced ‌integrated circuits (ICs)‌ and ‌semiconductor separators‌. With diameters customizable from ‌15μm to 50μm‌, it delivers exceptional ‌electrical conductivity‌, ‌thermal stability‌, and ‌bond strength‌ for microelectronic assemblies.
Key Benefits:
* Tailored Diameters‌ – Optimized for fine-pitch bonding in BGA, QFN, and CSP packages
* 99.99% Au Purity‌ – Minimizes ionic contamination in sensitive semiconductor environments
* ‌Superior Loop Control‌ – Enables consistent wedge/ball bonds in automated processes
* ‌Industry Compliance‌ – Meets ‌MIL-STD-883‌ and ‌JEDEC J-STD-006‌ standards
 
Critical Applications:
* High-density IC interconnects
* MEMS sensor packaging
* Power semiconductor modules
 

Physical Properties

Density:
19.34 g/cm3
Melting Point:
1063°C
Electrical Resistivity: (@20°C)
2.3 μΩ-cm
Electrical Conductivity: (@20°C)
75% (IACS)
Thermal Conductivity: (@20°C)
315 W/(m-K)
Fusing Current (10 mm x 25 μm)
0.52 A
 
We take pride in offering a complete range of wire diameters, thereby fulfilling the diverse needs for strength and elongation in different wire applications. Moreover, we collaborate closely with our customers to provide customized solutions. In these custom solutions, technical parameters such as tensile strength and elongation are meticulously tailored to meet their specific requirements. This customer-centric approach enables us to not only meet but exceed the expectations of our clients in the highly competitive market of wire manufacturing and bonding applications.
 
Composition
Diameter
Tensile Strength (gms)
Elongation (%)
99.99% Au
0.7 mil
17.5 μm
3 - 10
2 - 6
0.8 mil
20 μm
4 - 13
2 - 7
0.9 mil
22.5 μm
5 - 16
2 - 8
1.0 mil
25 μm
6 - 20
2 - 8
1.3 mil
32.5 μm
10 - 45
2 - 10
1.5 mil
37.5 μm
13 - 50
2 - 12
1.7 mil
42.5 μm
15 - 60
2 - 12
1.8 mil
45 μm
20 - 70
2 - 12
2.0 mil
50 μm
25 - 85
2 - 15
3.0 mil
75 μm
50 - 180
2 - 20
 
Why Gold Bonding Wire?
Gold (Au) bonding wire is used in a wide range of applications rangining from high pin-count, ultra-fine pitch microelectronic devices to high-power discrete components. Au is the preferred choice of bonding material when a) the contact material is not compatible with Aluminum (Al) and/or Copper (Cu) b) the contact area is limited c) the device will be subject to high temperature or high humidity environments.
 
The Advantages of Gold Bonding Wire:
• Extreme bond reliability
• A wide processing window
• Low-impact ball and wedge bonding
• Superior looping performance
• High tensile test performance
• Excellent corrosion resistance
• Higher fusing current than standard Al bond wire.
 

 

Customizable Ultra Fine Gold Bonding Wire for Inner Lead Packaging in Integrated Circuits and Semiconductor Separators 0

1.What kind of Enameled copper wire do Winner produce?

We focus on research and development of selfbonding magnet round copper wire, fine polyurethane magnet wire, selfbonding litz copper wire and selfbonding silk covered wire.

 

2.What's diameters available of the Enamelled copper wire ?

We specialize in fine and ultra fine enamelled copper wire,diameters available of our products is Φ0.018-0.50mm.

 

3.What's selfbonding enameled copper wire?

Selfbonding enamelled copper wire is a special type of enamelled wire with an additional adhesive enamel overcoat such as thermoplastic resin.This adhesive has a bonding feature, which is activated

by heat or solvents.

Once activated the adhesive bonds turn to turn windings into a compact self supporting coil.

The use of selfbonding wire may offer cost and manufacturing advantages in some winding applications

as bobbins, tape, varnishing, or impregnation may be eliminated.

 

4. Is possible to get any sample of selfbonding enamelled copper wire that you have in production?

Of course you can!

Customizable Ultra Fine Gold Bonding Wire for Inner Lead Packaging in Integrated Circuits and Semiconductor Separators 1

Customizable Ultra Fine Gold Bonding Wire for Inner Lead Packaging in Integrated Circuits and Semiconductor Separators 2

Customizable Ultra Fine Gold Bonding Wire for Inner Lead Packaging in Integrated Circuits and Semiconductor Separators 3

 

Customizable Ultra Fine Gold Bonding Wire for Inner Lead Packaging in Integrated Circuits and Semiconductor Separators 4

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