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Bonding Wire

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Gold Plated Tungsten Wire

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Gold Plated Copper Wire

(21)

Gold Plated Molybdenum Wire

(50)

Tungsten Wire

(25)

Gold Plated Silver Wire

(26)

Palladium Coated Copper Wire

(42)

Ultra Fine Copper Wire

(10)

Beryllium Copper Wire

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Spring Test Probes

(61)

Gold Electroplating Service

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Stable Structure Gold Plated Copper Wire

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Bonding Aluminum Wire For Power Electronics In Automotive Computing Equipment

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Electronics Palladium Coated Copper Wire For Optoelectronic Packaging

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0.1mm Gold Plated Silver Wire For Copier Electrode Replacement

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Highly Resistant Gold Plated Silver Wire With Advanced Composite Material

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Customizable Gold Plated Tungsten Wire 0.001mm-3mm 500 MPa Tensile Strength

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15–25μm Gold Plated Silver Wire for IC & LED Packaging | High Reliability Micro Wire

Product Type: Bonding Wire

Coating: Gold

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Gold Plated Silver Bonding Wire Manufacturer 15μm 18μm 20μm 25μm Ultra Fine Wire

Product Type: Bonding Wire

Coating: Gold

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15 μm Diameter Gold Plated Silver Wire Spooled Wire Ultra Fine Wire for High Frequency RF and Signal Integrity Applications

Product Type: Bonding Wire

Coating: Gold

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0.005mm Ultra-fine Unenamelled Copper Wire for PCB Soldering Repair

Application: Wire Bonding

Package: Spool

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Excellent Thermal Conductivity Ultra-thin Copper Wire For Microchips

Application: Wire Bonding

Package: Spool

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High-Performance Tungsten-Rhenium Wires for Extreme Environments

Purity Of Tungsten Before Rhenium Addition: 99.999% W

Coating Thickness: 0.5 +/- 0.07

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Ag Alloy Bonding Wire For Semiconductor Devices

Product Type: Bonding Wire

Material: Ag

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1000m roll 18 micron (0.7 mil) diameter AuPdCu wire Bonding for Automotive Devices

Product Type: Bonding Wire

Coating: Au ,Palladium

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Automotive Grade PdCu Bonding Wire For Power Modules

Package: Spool

Surface Finish: Bright

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uniform palladium coating ultra fine Pd coated copper wire 15um / 18um / 20um

Package: Spool

Surface Finish: Bright

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High Electrical Conductivity Pdcu Bonding Wire Bonding Wire For Ic Chip Interconnection

Package: Spool

Surface Finish: Bright

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Ultra Thin Coating Layer Pd Coated Copper Bonding Wire For QFN / QFP Packaging

Package: Spool

Surface Finish: Bright

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China Semiconductor Palladium Coated Copper Wire For Bonding

Package: Spool

Surface Finish: Bright

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30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor

Application: Semiconductor Packaging, Microelectronics, Medical Devices

Package: Spool

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Conductivity stabilty 18µm (0.7mil) Gold Bonding WIRE applycation in Aerospace

Application: Semiconductor Packaging, Microelectronics, Medical Devices

Package: Spool

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4N Purity 25µm (1.0mil) Gold Bonding WIRE Directly Supply Research Labs

Application: Semiconductor Packaging, Microelectronics, Medical Devices

Package: Spool

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