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Bonding Wire

(76)

Gold Plated Tungsten Wire

(55)

Gold Plated Copper Wire

(21)

Gold Plated Molybdenum Wire

(35)

Tungsten Wire

(25)

Gold Plated Silver Wire

(26)

Palladium Coated Copper Wire

(37)

Ultra Fine Copper Wire

(10)

Beryllium Copper Wire

(18)

Spring Test Probes

(61)

Gold Electroplating Service

(2)

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Stable Structure Gold Plated Copper Wire

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Bonding Aluminum Wire For Power Electronics In Automotive Computing Equipment

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Electronics Palladium Coated Copper Wire For Optoelectronic Packaging

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0.1mm Gold Plated Silver Wire For Copier Electrode Replacement

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Highly Resistant Gold Plated Silver Wire With Advanced Composite Material

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Customizable Gold Plated Tungsten Wire 0.001mm-3mm 500 MPa Tensile Strength

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Precision-Engineered Gold Plated Spring Test Probe with 80g Spring Force and 1A Current Ration for PCB Testing

Product Name: Standard Size Test Probe

Plunger: BeCu

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P75-E2 Spring Test Probe with 1.3mm Conical Head and 1.02mm Tube Diameter for 3A PCB Testing

Product Name: Standard Size Test Probe

Plunger: BeCu

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Customized Gold Plated Spring Test Probe with 2.54mm Pitch and 4.0 Full Travel for PCB Testing

Product Name: Standard Size Test Probe

Plunger: BeCu

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Spring Test Probe with 24.5 mm Length and 1.5 mm Needle Diameter for 4 mm Full Stroke PCB Testing

Product Name: Standard Size Test Probe

Plunger: BeCu

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100mil Spring Test Probe with Crown Tip and BeCu Plunger for High Hitting Accuracy

Product Name: Standard Size Test Probe

Plunger: BeCu

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Gold Plated Spring Test Probe with Brass Barrel and BeCu Plunger for Precision PCB Testing

Product Name: Standard Size Test Probe

Plunger: BeCu

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5A 2.03 MM Outer Diameter GKS-003 Pitch Gold-plated Test Probe with BeCu Plunger and Brass Barrel

Product Name: Standard Size Test Probe

Plunger: BeCu

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Big Round Head Spring Test Probe with High Passing Current and Low Impedance for PCB Testing

Product Name: Test Probe

Warranty: 12 Months,1 Year

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Customized 1.0mm Pitch 0.75mm Mounting Hole 2.0mm Full Travel Spring Test Probe for PCB & ICT Testing

Product Name: Standard Size Test Probe

Plunger: BeCu

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Customized Gold Plated Spring Test Probe with 1.90mm Pitch and 1.35mm/1.40mm Mounting Hole for PCB ICT Testing

Product Name: Standard Size Test Probe

Plunger: BeCu

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Customized Ultra-sharp Spring Test Probe with 100 pcs MOQ for ICT Testing

Product Name: Standard Size Test Probe

Plunger: BeCu

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Gold Plated Spring Test Probe with 9mm Total Length 6.5mm Tube Length and 2.5mm Needle for PCB Testing

Product Name: Test Probe

Warranty: 12 Months,1 Year

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Gold-Plated ICT FCT Spring Test Probes for Circuit Boards GKS-100 Series

Packaging Details: Roll, Neutrial Packing or with OEM LOGO

Delivery Time: 5-8 WORKING DAYS

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Ultra Fine Gold Bonding Wire, Dia. 13-70μm, 99.99% Purity

Application: Semiconductor Packaging, Microelectronics, Medical Devices

Package: Spool

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99.99% Pure Gold Bonding Wire 0.015mm 0.018mm 0.02mm 0.025mm 0.03mm

Application: Semiconductor Packaging, Microelectronics, Medical Devices

Package: Spool

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0.025mm Diameter Gold Bonding Wire for Semiconductor Packaging and Microelectronics Applications

Application: Semiconductor Packaging, Microelectronics, Medical Devices

Package: Spool

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