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Bonding Wire

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Gold Plated Tungsten Wire

(42)

Gold Plated Copper Wire

(21)

Gold Plated Molybdenum Wire

(8)

Tungsten Wire

(16)

Gold Plated Silver Wire

(12)

Palladium Coated Copper Wire

(26)

Ultra Fine Copper Wire

(8)

Beryllium Copper Wire

(18)

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Gold Electroplating Service

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Bonding Aluminum Wire For Power Electronics In Automotive Computing Equipment

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Electronics Palladium Coated Copper Wire For Optoelectronic Packaging

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0.1mm Gold Plated Silver Wire For Copier Electrode Replacement

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Highly Resistant Gold Plated Silver Wire With Advanced Composite Material

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Stable Structure Gold Plated Copper Wire With High Breaking Load And Excellent Material

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Customizable Gold Plated Tungsten Wire 0.001mm-3mm 500 MPa Tensile Strength

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0.01mm-0.5mm 6N High Purity Aluminium Bonding Wires For Power Semiconductor Packaging

Diameter: 0.01mm - 0.5mm

Breaking Load BL(gf): >4

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Bright Matte Oxidized Bonding Wire Aluminum Alloy 0.01mm-0.5mm Medical Devices

Diameter: 0.01mm - 0.5mm

Breaking Load BL(gf): >4

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Superior Al Wire Bonding For Precision Bonding In Microelectronics Power Semiconductor Industry

Diameter: 0.001mm - 0.05mm

Breaking Load BL(gf): >4

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0.7mil Ultra Fine Copper Wire With Electrical And Thermal Conductivity Polished Surface

Diameter: 18(0.7mil)

Breaking Load BL(gf): >4

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Automotive Electronics Testing Weapon Facilities In Aerospace Industry Ultra Fine Copper Wire

Breaking Load BL(gf): >4

Elongation EL(%): 3-20

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0.01mm-0.1mm Ultra Fine Copper Wire For Aerospace Industry Automotive Electronics

Breaking Load BL(gf): >4

Elongation EL(%): 3-20

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Good Conductor of Electricity Beryllium Copper Wire with Good Corrosion Resistance and hot formability

Tensile Strength: ≥980MPa

Coating Material: Ultra-fine Coating

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Higher Strength Level Beryllium Copper Conductor Material Wire with Excellent Corrosion Resistance 0.01mm-0.4mm Diameter

Tensile Strength: ≥980MPa

Coating Material: Ultra-fine Coating

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Top Performance Ultra Fine Beryllium Coated Copper Wire for Precision Applications

Tensile Strength: ≥980MPa

Coating Material: Ultra-fine Coating

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Industrial Grade Beryllium Copper Wire 0.01mm-0.4mm In Metalworking And Joining Processes

Tensile Strength: ≥980MPa

Coating Material: Ultra-fine Coating

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High Temperature Resistance High Purity Silver Alloy Bonding Wire Stable Structure

Diameter: 18(0.7mil)

Breaking Load BL(gf): >4

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Aerospace Industry Ultra Fine Copper Wire Corrosion Resistance

Breaking Load BL(gf): >4

Elongation EL(%): 3-20

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High Strength Palladium Coated Copper Wire With 4N High Purity Copper Material For IC Packaging

Elongation: 10%

Color: Silver

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0.01mm Palladium Coated Copper Bonding Wire High Strength Purity 99.99% Surface Finish Bright

Flexibility: Good

Bonding Method: Ultrasonic, Thermocompression, Laser

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Palladium Coated Copper Wire With Ultra Fine 0.01mm Diameter For Integrated Circuits

Plating: Palladium

Material: Copper

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4N High Purity Copper Material Palladium Coated Copper Wire Electronics

Elongation: 10%

Color: Silver

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