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SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD. Products online

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Bonding Wire

(46)

Gold Plated Tungsten Wire

(26)

Gold Plated Copper Wire

(18)

Gold Plated Silver Wire

(12)

Palladium Coated Copper Wire

(24)

Ultra Fine Copper Wire

(8)

Beryllium Copper Wire

(15)

Gold Plated Molybdenum Wire

(6)

Tungsten Wire

(4)
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Electronics Palladium Coated Copper Wire For Optoelectronic Packaging

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Bonding Aluminum Wire For Power Electronics In Automotive Computing Equipment

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0.1mm Gold Plated Silver Wire For Copier Electrode Replacement

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Customizable Gold Plated Tungsten Wire 0.001mm-3mm 500 MPa Tensile Strength

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Highly Resistant Gold Plated Silver Wire With Advanced Composite Material

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Stable Structure Gold Plated Copper Wire With High Breaking Load And Excellent Material

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Good price Ultra Fine 0.01mm Diameter High-Strength Palladium Coated Copper Wire With Low Curvature And High Toughness online Video

Ultra Fine 0.01mm Diameter High-Strength Palladium Coated Copper Wire With Low Curvature And High Toughness

Plating: Palladium

Material: Copper

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Good Reliability at High Temperatures Ultra Fine wire 0.01 mm Cu Bonding Wire for electronics package

Bonding Method: Ultrasonic, Thermocompression, Thermosonic

Diameter: 0.01mm - 0.4mm

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Density: 8.96 G/cm3

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0.01mm Diameter Ultra Fine Gold Bonding Wire Meeting the Demands of Ultra-Fine Electronic Bonding

Density: 19.34 G/cm3

Purity: 99.99%

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Stable Bonding Solutions With High-performance Palladium Plated Copper Wire For Microelectronic Packaging

Diameter: 0.1mm

Elongation: 25%

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Material: Silver

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Thickness 0.01mm Gold Plated Silver Wire with Competitive Cost Advantage for Heat Dissipation and Stable Performance

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Industrial Grade Beryllium Copper Wire 0.01mm-0.4mm In Metalworking And Joining Processes

Tensile Strength: ≥980MPa

Coating Material: Ultra-fine Coating

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Packaging Details: Neutrial Packing

Delivery Time: 3~7 working days

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