Plating: Palladium
Material: Copper
Plating: Palladium
Material: Copper
Plating: Palladium
Material: Copper
Plating: Palladium
Material: Copper
Plating: Palladium
Material: Copper
Plating: Palladium
Material: Copper
Diameter: 0.01mm
Conductivity: High
Diameter: 0.01mm - 0.4mm
Material: Copper
Density: 8.96 G/cm3
Bond Strength: High
Bonding Method: Ultrasonic, Thermocompression, Thermosonic
Diameter: 0.01mm - 0.4mm
Density: 19.34 G/cm3
Purity: 99.999%
Bonding Method: Ultrasonic, Thermocompression, Thermosonic
Diameter: 0.01mm - 0.4mm
Diameter: 0.1mm
Elongation: 25%
Plating: Palladium
Material: Copper
Density: 8.96 G/cm3
Bond Strength: High
Bond Strength: High
Elongation: 1% - 50%
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