Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Purity Of Tungsten Before Rhenium Addition: 99.95% W
Coating Thickness: 0.5 +/- 0.07
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Coating: Gold
Bond Strength: High
Coating: Gold
Bond Strength: High
Coating: Gold
Bond Strength: High
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Coating: Gold
Bond Strength: High
Coating: Gold
Bond Strength: High
Coating: Gold
Bond Strength: High
Coating: Gold
Bond Strength: High
Coating: Gold
Bond Strength: High
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