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Bonding Aluminum Wire For Power Electronics In Automotive Computing Equipment

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Electronics Aluminum Bonding Wire High Purity For Automotive Computing Equipment

Diameter: 0.001mm - 0.05mm

Breaking Load BL(gf): >4

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99.99% Silver Alloy Wire Bond Wire For Heat Dissipation And Electrical Conductivity

Diameter: 18(0.7mil)

Breaking Load BL(gf): >4

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0.7mil Silver Alloy Bonding Wire High Tech Industries Semiconductor Packaging

Diameter: 18(0.7mil)

Breaking Load BL(gf): >4

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High Temperature Resistance High Purity Silver Alloy Bonding Wire Stable Structure

Diameter: 18(0.7mil)

Breaking Load BL(gf): >4

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0.01mm-0.5mm 6N High Purity Aluminium Bonding Wires For Power Semiconductor Packaging

Diameter: 0.01mm - 0.5mm

Breaking Load BL(gf): >4

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Bright Matte Oxidized Bonding Wire Aluminum Alloy 0.01mm-0.5mm Medical Devices

Diameter: 0.01mm - 0.5mm

Breaking Load BL(gf): >4

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Superior Al Wire Bonding For Precision Bonding In Microelectronics Power Semiconductor Industry

Diameter: 0.001mm - 0.05mm

Breaking Load BL(gf): >4

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Thermal Conductivity Silver 0.7mil Bonding Wires For Automotive Aerospace Medical Industries

Diameter: 18(0.7mil)

Breaking Load BL(gf): >4

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Electrical Conductivity Silver Bondable Wire For Automotive Aerospace Medical Industries

Diameter: 18(0.7mil)

Breaking Load BL(gf): >4

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Heat Dissipation Silver Alloy Bonding Wire For Automotive Aerospace Medical Industries

Diameter: 18(0.7mil)

Breaking Load BL(gf): >4

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Ultrasonic Laser Aluminum Bonding Wire With Composite Material Treatment

Diameter: 0.001mm - 0.05mm

Breaking Load BL(gf): >4

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Thyristor Packaging Aluminum Bonding Wire For Power Semiconductors

Diameter: 0.001mm - 0.05mm

Breaking Load BL(gf): >4

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Aluminum Bonding Wire For Power Semiconductors In Automotive Computing Equipment

Diameter: 0.001mm - 0.05mm

Breaking Load BL(gf): >4

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SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.

Sichuan WINNER Special Electronic Materials Co., Ltd. focuses on ultra-fine coated metal wire for semiconductor packaging. Winner is a global leader!

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