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Bonding Aluminum Wire For Power Electronics In Automotive Computing Equipment

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20um Gold Bonding Wire for High Electrical Performance and Low Loop in Semiconductor Packaging

Application: Semiconductor Packaging, Microelectronics, Medical Devices

Package: Spool

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Ultrasonic Bonding Gold Wire with Bright Surface Finish for Semiconductor Packaging

Application: Semiconductor Packaging, Microelectronics, Medical Devices

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24K Gold Bonding Wire 1mm Diameter for Microelectronics with 4N 99.99% Purity

Application: Semiconductor Packaging, Microelectronics, Medical Devices

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9999 Pure 0.03mm Round Gold Wire 30um Metal Au Bonding Wire

Application: Semiconductor Packaging, Microelectronics, Medical Devices

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High Corrosion Resistance Gold Bonding Wire with Ultrasonic Bonding Method and Bright Surface Finish

Application: Semiconductor Packaging, Microelectronics, Medical Devices

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Ultra Fine Gold Bonding Wire with 0.0125mm and 0.05mm Diameter for Scientific Research

Application: Semiconductor Packaging, Microelectronics, Medical Devices

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Hot Sale Best Quality 99.99% Gold Wire For Electronics and Semiconductors

Application: Semiconductor Packaging, Microelectronics, Medical Devices

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99.999% Fine Gold Bonding Wire with 500/1000 Meters Length and 98% Conductivity for Microelectronics

Application: Semiconductor Packaging, Microelectronics, Medical Devices

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Hot Sale Best Quality PurityGold Wire 99.99%

Application: Semiconductor Packaging, Microelectronics, Medical Devices

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99.999% Fine Gold/au Wire 0.018mm 0.025mm 0.03mm 0.05mm Diameter Gold Bonding Wire

Application: Semiconductor Packaging, Microelectronics, Medical Devices

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0.025mm 99.99% Purity Gold Bonding Wire with 500/1000 Meters Length for High Precision Applications

Application: Semiconductor Packaging, Microelectronics, Medical Devices

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0.076mm customized Gold Plated Tungsten Spooled Wire Strong tensile tungsten wire

Packaging Details: Vacuum + carton

Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram， Paypal

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Customizable Ultra Fine Gold Bonding Wire for Inner Lead Packaging in Integrated Circuits and Semiconductor Separators

Density: 19.34 G/cm3

Purity: 99.99%

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Advanced Silver Alloy Bonding Wire for Stable Electrical Connections and Heat Management in Different Industries

Diameter: 18(0.7mil)

Breaking Load BL(gf): >4

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High Purity Ultra Fine Gold Bonding Wire of 0.01mm Diameter for Microscale Electronics

Purity: 99.99%

Material: Gold

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Thyristor Packaging Aluminum Bonding Wire For Power Semiconductors

Diameter: 0.001mm - 0.05mm

Breaking Load BL(gf): >4

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