Breaking Load BL(gf): >4
Elongation EL(%): 3-20
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
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