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Bonding Wire

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Gold Plated Tungsten Wire

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Gold Plated Copper Wire

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Gold Plated Molybdenum Wire

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Tungsten Wire

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Gold Plated Silver Wire

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Palladium Coated Copper Wire

(26)

Ultra Fine Copper Wire

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Beryllium Copper Wire

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Bonding Aluminum Wire For Power Electronics In Automotive Computing Equipment

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Electronics Palladium Coated Copper Wire For Optoelectronic Packaging

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0.1mm Gold Plated Silver Wire For Copier Electrode Replacement

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Highly Resistant Gold Plated Silver Wire With Advanced Composite Material

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Stable Structure Gold Plated Copper Wire With High Breaking Load And Excellent Material

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Customizable Gold Plated Tungsten Wire 0.001mm-3mm 500 MPa Tensile Strength

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High Performance Palladium Plated Copper Wire For Critical Applications

Diameter: 0.1mm

Length Meters: 500/1000

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0.01mm Palladium Coated Copper Bonding Wire High Strength Purity 99.99% Surface Finish Bright

Flexibility: Good

Bonding Method: Ultrasonic, Thermocompression, Laser

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Ultra Fine 0.01mm Diameter High-Strength Palladium Coated Copper Wire With Low Curvature And High Toughness

Plating: Palladium

Material: Copper

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Palladium Coated Copper Wire With Ultra Fine 0.01mm Diameter For Integrated Circuits

Plating: Palladium

Material: Copper

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High Strength Ultra Fine 0.01mm Diameter Copper Palladium Alloy Wire For High Performance IC Bonding

Diameter: 0.01mm

Conductivity: High

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High Performance Palladium Coated Copper Wire 15μm Thickness 30% Harder than Gold for Automotive Medical Telecom Chip Modules

Elongation: 10%

Color: Silver

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Ultra Fine 0.01mm Diameter Professional Grade Palladium Coated Copper Wire With Higher Hardness For Semiconductor Packaging

Plating: Palladium

Material: Copper

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High Conductivity Ultra Fine 0.01mm Diameter Pd Coated Copper Wire For Optoelectronic Packaging

Plating: Palladium

Material: Copper

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Ultra Fine 0.01mm Diameter Palladium Coated Copper Wire For Integrated Circuits

Plating: Palladium

Material: Copper

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Ultra Fine 0.01mm Palladium Coated Copper Wire With Low Curvature And High Toughness For IC Packaging

Plating: Palladium

Material: Copper

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Microelectronic Packaging's Choice Ultra Fine 0.01mm Diameter Copper Palladium Alloy Wire And For Integrated Circuits

Plating: Palladium

Material: Copper

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Top Choice Durable Ultra Fine 0.01mm Diameter Palladium Plated Copper Wire For Electrical Projects

Applications: Electronics, Automotive, Aerospace

Coating: Palladium

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Precision Engineered 15μm Pd Cu Bonding Wire Ultra Fine Pitch Compatibility for Sustainable Semiconductor Production

Elongation: 10%

Color: Silver

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Stable Bonding Solutions With High-performance Palladium Plated Copper Wire For Microelectronic Packaging

Diameter: 0.1mm

Elongation: 25%

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Strong Oxidation Resistance Palladium Plated Copper Wire For Manufacturing Of Electronic Components

Plating: Palladium

Material: Copper

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Ultra Fine Pd Coated Copper Wire With Bright Blue Coating High Strength 0.01mm Silver Core Bonding Wire For Semiconductor And 5G Device Assembly

Applications: Electronics, Automotive, Aerospace

Coating: Palladium

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