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aluminum bonding wire
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Bonding Wire

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Gold Plated Tungsten Wire

(26)

Gold Plated Copper Wire

(21)

Gold Plated Silver Wire

(12)

Palladium Coated Copper Wire

(25)

Ultra Fine Copper Wire

(8)

Beryllium Copper Wire

(15)

Gold Plated Molybdenum Wire

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Tungsten Wire

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aluminum bonding wire (52)  Online Manufacturer

Good price Ultra Pure Aluminum Bonding Wire With High Conductivity Aluminum Wire For Wire Bonding online Video

Ultra Pure Aluminum Bonding Wire With High Conductivity Aluminum Wire For Wire Bonding

Diameter: 0.001mm - 0.05mm

Breaking Load BL(gf): >4

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Good price 6N High Purity Aluminum Bonding Wire For Power Semiconductor Packaging online Video

6N High Purity Aluminum Bonding Wire For Power Semiconductor Packaging

Diameter: 0.001mm - 0.05mm

Breaking Load BL(gf): >4

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Good price Ultrasonic Laser Aluminum Bonding Wire With Composite Material Treatment online Video

Ultrasonic Laser Aluminum Bonding Wire With Composite Material Treatment

Diameter: 0.01mm - 0.5mm

Breaking Load BL(gf): >4

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Good price Aluminum Bonding Wire For Power Semiconductors In Automotive Computing Equipment online Video

Aluminum Bonding Wire For Power Semiconductors In Automotive Computing Equipment

Diameter: 0.01mm - 0.5mm

Elongation EL(%): 3-20

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Good price Electronics Aluminum Bonding Wire High Purity For Automotive Computing Equipment online Video

Electronics Aluminum Bonding Wire High Purity For Automotive Computing Equipment

Diameter: 0.001mm - 0.05mm

Breaking Load BL(gf): >4

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Good price Thyristor Packaging Aluminum Bonding Wire For Power Semiconductors online Video

Thyristor Packaging Aluminum Bonding Wire For Power Semiconductors

Diameter: 0.001mm - 0.05mm

Breaking Load BL(gf): >4

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Good price Bright Matte Oxidized Bonding Wire Aluminum Alloy 0.01mm-0.5mm Medical Devices online Video

Bright Matte Oxidized Bonding Wire Aluminum Alloy 0.01mm-0.5mm Medical Devices

Diameter: 0.01mm - 0.5mm

Breaking Load BL(gf): >4

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Good price Excellent Electrical Conductivity Ultra Fine Wire 0.01 Mm Cu Bonding Wire For Semiconductor Packaging online Video

Excellent Electrical Conductivity Ultra Fine Wire 0.01 Mm Cu Bonding Wire For Semiconductor Packaging

Bonding Method: Ultrasonic, Thermocompression, Thermosonic

Diameter: 0.01mm - 0.4mm

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Good price Good Reliability at High Temperatures Ultra Fine wire 0.01 mm Cu Bonding Wire for electronics package online Video

Good Reliability at High Temperatures Ultra Fine wire 0.01 mm Cu Bonding Wire for electronics package

Bonding Method: Ultrasonic, Thermocompression, Thermosonic

Diameter: 0.01mm - 0.4mm

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Good price Copper Bonding Wire Ultra Fine Wire 0.01 Mm With High Levels Of Electrical And Thermal Conductivity online Video

Copper Bonding Wire Ultra Fine Wire 0.01 Mm With High Levels Of Electrical And Thermal Conductivity

Diameter: 0.01mm - 0.4mm

Material: Copper

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Good price Semiconductor Electronics Aluminum Alloy Bonding Wire 6N High Purity 0.001mm-0.05mm online Video

Semiconductor Electronics Aluminum Alloy Bonding Wire 6N High Purity 0.001mm-0.05mm

Diameter: 0.001mm - 0.05mm

Breaking Load BL(gf): >4

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Good price 6N High Purity Aluminum Alloy Bonding Wire For Power Semiconductor Packaging online Video

6N High Purity Aluminum Alloy Bonding Wire For Power Semiconductor Packaging

Diameter: 0.001mm - 0.05mm

Breaking Load BL(gf): >4

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Good price Premium Aluminum Alloy Bonding Wire 6N High Purity Material With Trace Elements Essential online Video

Premium Aluminum Alloy Bonding Wire 6N High Purity Material With Trace Elements Essential

Diameter: 0.001-0.02 Inches

Breaking Load BL(gf): >4

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Good price 0.01mm-0.5mm 6N High Purity Aluminium Bonding Wires For Power Semiconductor Packaging online Video

0.01mm-0.5mm 6N High Purity Aluminium Bonding Wires For Power Semiconductor Packaging

Diameter: 0.01mm - 0.5mm

Breaking Load BL(gf): >4

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Good price 0.01mm Diameter Ultra Fine Gold Bonding Wire Meeting the Demands of Ultra-Fine Electronic Bonding online Video

0.01mm Diameter Ultra Fine Gold Bonding Wire Meeting the Demands of Ultra-Fine Electronic Bonding

Density: 19.34 G/cm3

Purity: 99.99%

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Good price High tensile test performance Ultra Fine Wire Gold Bonding Wire for semiconductor packaging and assembly processes online Video

High tensile test performance Ultra Fine Wire Gold Bonding Wire for semiconductor packaging and assembly processes

Density: 19.34 G/cm3

Purity: 99.99%

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