wire bond wire (238) Online Manufacturer
Diameter: 18(0.7mil)
Breaking Load BL(gf): >4
Diameter: 23(0.9mil)
Breaking Load BL(gf): >4
Diameter: 18(0.7mil)
Breaking Load BL(gf): >4
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Purity: 99.99%
Bonding Method: Ultrasonic, Thermocompression, Laser
Coating: Gold
Bond Strength: High
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Corrosion Resistance: Excellent
Surface Finish: Smooth
Elongation: 30%
Material: Copper
Heat Treatment: 3 Hr 315C-330C
Melting Point: 870-980°C
Resistance: 0.02 Ω/m
Corrosion Resistance: Excellent
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
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