wire bond wire (296) Online Manufacturer
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Product Type: Bonding Wire
Coating Thickness: 0.0003mm
Flexibility: Good
Bonding Method: Ultrasonic, Thermocompression, Laser
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Product Type: Bonding Wire
Coating: Au ,Palladium
Product Type: Bonding Wire
Material: Ag
Plating: Gold
Purity: 99.99%
Purity: 99.99%
Bonding Method: Ultrasonic, Thermocompression, Laser
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