wire bond wire (238) Online Manufacturer
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Flexibility: Good
Bonding Method: Ultrasonic, Thermocompression, Laser
Coating: Gold
Bond Strength: High
Diameter: 18(0.7mil)
Breaking Load BL(gf): >4
Density: 8.96 G/cm3
Bond Strength: High
Bond Strength: High
Elongation: 1% - 50%
Density: 8.96 G/cm3
Bond Strength: High
Density: 19.34 G/cm3
Purity: 99.99%
Applications: Electronics, Automotive, Aerospace
Coating: Palladium
Bonding Method: Ultrasonic, Thermocompression, Thermosonic
Diameter: 0.01mm - 0.4mm
Diameter: 0.001mm - 0.05mm
Breaking Load BL(gf): >4
Diameter: 0.001mm - 0.05mm
Breaking Load BL(gf): >4
Diameter: 0.001-0.02 Inches
Breaking Load BL(gf): >4
Diameter: 0.001mm - 0.05mm
Breaking Load BL(gf): >4
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