wire bond wire (238) Online Manufacturer
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Coating: Gold
Bond Strength: High
Coating: Gold
Bond Strength: High
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Coating: Gold
Bond Strength: High
Application: Semiconductor Packaging, Microelectronics, Medical Devices
Package: Spool
Product Type: Bonding Wire
Coating Thickness: 0.0003mm
Wire Gauge: Dia 0.01mm~0.4 Or As Your Demand
Purity: 99.999%
Wire Gauge: Dia 0.01mm~0.4 Or As Your Demand
Purity: 99.999%
Applications: Electronics, Automotive, Aerospace
Coating: Palladium
Elongation: 10%
Color: Silver
Application: Electronics, Aerospace, Medical, Jewelry
Coating: Gold Plating
Plating: Palladium
Material: Copper
Plating: Palladium
Material: Copper
Plating: Palladium
Material: Copper
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